Micro LED Display Bonding and Wiring to Cut Transfer Defects
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Solution Overview
Problem
The existing methods for manufacturing micro LED display devices are time-consuming and prone to connection defects, leading to reduced yield as the number of micro LEDs increases with higher image quality.
Innovation Solution
A method for manufacturing an image display device that involves preparing a semiconductor layer with a light-emitting layer on a first substrate, bonding it to a third substrate with a circuit, forming a light-emitting element by etching, covering it with a light-transmissive insulating member, and forming a wiring layer to electrically connect the light-emitting element to the circuit element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If individually-formed micro LEDs are sequentially transferred to a drive circuit substrate, then connection between micro LEDs and drive circuits can be achieved, but the transfer process takes an enormous amount of time and connection defects may occur reducing yield
Solution Approach 1:
The patent merges multiple micro LEDs into a single integrated semiconductor layer that is transferred as one unit to the drive circuit substrate. This combining approach eliminates the need for sequential individual transfer, dramatically reducing transfer time and minimizing connection defects while maintaining reliable electrical connections between all micro LEDs and the drive circuit.
Solution Approach 2:
The patent performs preliminary actions by forming all micro LEDs within a single semiconductor layer before the transfer process. The semiconductor layer is prepared with multiple light-emitting elements already integrated, and the drive circuit substrate is prepared with corresponding connection structures, so that when transfer occurs, all connections are established simultaneously in one step rather than sequentially.
2Manufacturing precision
If the number of micro LEDs is increased for higher image quality such as full high definition, 4K, 8K, then image quality is improved, but the transfer process becomes even more time-consuming and yield decreases due to increased connection defects
Solution Approach 1:
The patent merges a large number of micro LEDs into a single integrated semiconductor layer structure. This allows high-definition displays requiring thousands of micro LEDs to be transferred as one unified component, maintaining manufacturing precision for high image quality while dramatically improving productivity by reducing the transfer process to a single operation regardless of the number of individual light-emitting elements.
3Manufacturing precision
If individually-formed micro LEDs are transferred sequentially, then each micro LED can be positioned precisely, but the overall process time increases enormously
Solution Approach 1:
The patent merges multiple micro LEDs into a single semiconductor layer with predetermined positioning. The entire layer is transferred simultaneously to the drive circuit substrate in one operation, achieving both precise positioning (through pre-formed alignment structures) and rapid transfer (by eliminating sequential operations).
Solution Approach 2:
The patent performs preliminary positioning actions by forming alignment structures and connection patterns on both the semiconductor layer and drive circuit substrate before transfer. This pre-positioning ensures that when the semiconductor layer is transferred as a whole, all micro LEDs are correctly positioned and connected in a single step, eliminating time-consuming sequential positioning.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method shortens the transfer process of light-emitting elements and increases yield, enabling the production of high-quality image display devices with improved efficiency and reduced defects.
Implementation Method 1
a process of bonding the semiconductor layer to the third substrate
Implementation Method 2
The insulating member is provided so that light radiated from the light-emitting element has a light distribution in a normal direction of the light-emitting surface toward the light-emitting surface side
Data Source
AI summary
A method for manufacturing an image display device includes: providing a second substrate that comprises a first substrate, and a semiconductor layer on the first substrate, the semiconductor layer comprising a light-emitting layer; providing a third substrate comprising a circuit, the circuit comprising a circuit element; bonding the semiconductor layer to the third substrate; forming a light-emitting element by etching the semiconductor layer; covering the light-emitting element with a light-transmissive insulating member; and forming a wiring layer electrically connecting the light-emitting element to the circuit element; wherein: the light-emitting element has a light-emitting surface opposite to a surface of the light-emitting element that is bonded to the third substrate; and the insulating member is configured to cause light radiated from the light-emitting element to have a light distribution in a normal direction of the light-emitting surface toward a light-emitting surface side.