Micro LED Display Bonding and Via Layout for Faster Transfer
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Solution Overview
Problem
The existing methods for manufacturing image display devices using micro LEDs are time-consuming and prone to connection defects, especially as the number of micro LEDs increases with higher image quality, leading to reduced yield and increased costs.
Innovation Solution
A method for manufacturing an image display device that involves preparing a semiconductor layer with a light-emitting layer on a first substrate, bonding it to a circuit substrate with a conductive layer including a light-reflective part, and forming a light-emitting element by etching the semiconductor layer, followed by insulating film formation and via creation to electrically connect the light-emitting element and circuit element.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If individually-formed micro LEDs are sequentially transferred to a drive circuit substrate, then connection between light-emitting elements and drive circuits is achieved, but the transfer process becomes extremely time-consuming and connection defects increase
Solution Approach 1:
The patent merges multiple micro LEDs into a single integrated light-emitting element unit that is transferred as one piece to the drive circuit substrate. This combining approach eliminates the need for sequential individual transfer, dramatically reducing transfer time and minimizing connection defects while maintaining reliable electrical connections between the light-emitting element and drive circuit.
Solution Approach 2:
The patent performs preliminary formation of the light-emitting element on a separate substrate before transfer to the drive circuit substrate. This preliminary action allows the light-emitting element to be fully prepared and tested in advance, enabling a single-step transfer process that improves both manufacturing efficiency and connection reliability without requiring sequential individual placement.
2Manufacturing precision
If the number of micro LEDs is increased to achieve higher image quality (full HD, 4K, 8K), then image resolution is improved, but the transfer process time increases enormously and yield decreases
Solution Approach 1:
The patent combines multiple light-emitting elements into a single integrated unit that can provide full HD, 4K, or 8K resolution. This merging approach allows high-resolution displays to be achieved without proportionally increasing the number of separate transfer operations, thereby reducing transfer process time while maintaining high image quality.
Solution Approach 2:
The patent performs preliminary integration of multiple light-emitting elements into a single composite element on a fabrication substrate before transfer. This preliminary action enables high-resolution displays to be prepared in advance as integrated units, eliminating the need for time-consuming sequential transfer of individual micro LEDs and significantly reducing overall transfer process time.
3Manufacturing precision
If individually-formed micro LEDs are sequentially transferred to achieve high-resolution displays, then image quality is improved, but connection defects increase and yield decreases
Solution Approach 1:
The patent merges multiple micro LEDs into a single integrated light-emitting element that delivers high-resolution display performance. This consolidation reduces the total number of connection points required, thereby minimizing connection defects and improving overall yield while maintaining the desired image resolution.
Solution Approach 2:
The patent performs preliminary formation and integration of the light-emitting element on a separate substrate before transfer to the drive circuit. This preliminary action allows for centralized quality control and defect detection before the final transfer, reducing the risk of connection defects and improving yield while achieving high-resolution displays.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly shortens the transfer process of light-emitting elements and increases yield, reducing the time and cost associated with manufacturing high-quality image display devices with higher image resolutions.
Implementation Method 1
a process of bonding the semiconductor layer to the third substrate
Implementation Method 2
a conductive layer including a light-reflective part formed on the first insulating film
Data Source
AI summary
A method for manufacturing an image display device includes: providing a second substrate that includes a first substrate, and a semiconductor layer grown on the first substrate, the semiconductor layer including a light-emitting layer; providing a third substrate including: a circuit including a circuit element formed on a light-transmitting substrate, a first insulating film covering the circuit, and a conductive layer including a light-reflective part formed on the first insulating film; bonding the semiconductor layer to the third substrate; forming a light-emitting element from the semiconductor layer; forming a second insulating film covering the conductive layer, the light-emitting element, and the first insulating film; forming a via extending through the first and second insulating films; and electrically connecting the light-emitting element and the circuit element by the via.