Micro LED Driving Substrate Buffer Structure for Uniform Bonding
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Solution Overview
Problem
The existing micro LED bonding process faces challenges in ensuring uniformity and yield due to inconsistent penetration depth of microstructures into micro LED electrodes, leading to uneven contact resistance and potential damage from excessive pressure.
Innovation Solution
A driving substrate with buffer structures surrounding the microstructures, made of photosensitive resin material, is used to facilitate consistent penetration depth and prevent damage during large-area bonding, allowing increased pressure without damaging the micro LEDs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If increased pressure is applied during bonding to improve bonding uniformity, then bonding uniformity improves, but micro LED chips may be damaged
Solution Approach 1:
The patent introduces a buffer structure surrounding the microstructure that acts as a protective cushion during the bonding process. This buffer structure prevents direct transmission of excessive pressure to the micro LED chip while still allowing sufficient pressure to achieve uniform bonding, thereby resolving the contradiction between bonding uniformity and chip damage prevention
2Reliability
If pressure is reduced to prevent micro LED damage, then chip safety improves, but bonding uniformity deteriorates
Solution Approach 1:
The buffer structure serves as an intermediary element between the bonding pressure and the micro LED chip. It mediates the pressure transmission by providing a controlled resistance that protects the chip while maintaining sufficient bonding pressure, thus achieving both chip safety and bonding uniformity simultaneously
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The buffer structures ensure uniform depth of micro LED electrodes insertion, improving bonding uniformity and yield while preventing micro LED chip damage, thus enhancing the micro LED bonding process.
Implementation Method 1
a material of the buffer structure is a photosensitive resin material
Data Source
AI summary
The present disclosure provides a driving substrate and a manufacturing method thereof, and a micro LED bonding method. The driving substrate includes: a base substrate; a driving function layer provided on the base substrate, and including a plurality of driving thin film transistors and a plurality of common electrode lines; a pad layer including a plurality of pads provided on a side of the driving function layer away from the base substrate, each pad including a pad body and a microstructure of hard conductive material provided on a side of the pad body away from the base substrate; and a plurality of buffer structures provided on the side of the driving function layer away from the base substrate, each buffer structure surrounding a portion of a corresponding microstructure close to the base substrate, and a height of the buffer structure being lower than a height of the microstructure.