Micro LED Display Bump Design for Short Circuit Prevention
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Solution Overview
Problem
The manufacturing process of micro light-emitting diode displays faces challenges with low reliability due to the risk of short circuits between small electrodes and pads on the driving circuit substrate, caused by misalignment or melting of bumps during the transfer and bonding process.
Innovation Solution
The design incorporates a micro light-emitting device display apparatus with a circuit substrate, micro light-emitting devices, and conductive bumps that extend into closed openings on the pads and electrodes, creating a larger contact area and voids, which enhances electrical connectivity and reliability by avoiding short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the micro light-emitting diode is heated and pressurized for electrical bonding, then the bonding strength is improved, but the risk of short circuit between electrodes and pads increases due to bump melting or misalignment
Solution Approach 1:
The bonding structure is segmented into multiple components: the conductive bump is divided into a first conductive portion and a second conductive portion separated by an insulating layer. This segmentation prevents direct electrical contact between adjacent bumps, eliminating the short circuit risk while maintaining bonding strength through the distributed contact areas.
Solution Approach 2:
An insulating layer is introduced as an intermediary between the first conductive portion and the second conductive portion of the bonding structure. This intermediary layer prevents electrical short circuits between adjacent electrodes and pads during the heating and pressurization process, while still allowing mechanical bonding to occur.
2Area of stationary object
If the distance between two adjacent electrodes is reduced, then the device integration density is improved, but the risk of short circuit between electrodes and pads increases
Solution Approach 1:
The bonding structure is segmented into multiple components: the conductive bump is divided into a first conductive portion and a second conductive portion separated by an insulating layer. This segmentation prevents direct electrical contact between adjacent bumps, eliminating the short circuit risk while maintaining bonding strength through the distributed contact areas.
Solution Approach 2:
The insulating layer extends in the vertical dimension between the first and second conductive portions, creating electrical isolation in the vertical direction. This allows horizontal spacing between electrodes to be minimized for higher density while maintaining electrical reliability through vertical insulation.
Data Source
AI summary
A micro light-emitting device display apparatus includes a circuit substrate, at least one micro light-emitting device, and at least one conductive bump. The circuit substrate includes at least one pad. The micro light-emitting device is disposed on the circuit substrate and includes at least one electrode. At least one of the pad and the electrode has at least one closed opening. The conductive bump is disposed between the circuit substrate and the micro light-emitting device. The conductive bump extends into the closed opening and defines at least one void with the closed opening. The electrode of the micro light-emitting device is electrically connected to the pad of the circuit substrate with the conductive bump.