Micro LED Mass Transfer Using an Intermediate Carrying Substrate
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Solution Overview
Problem
Existing technologies face challenges in efficiently and cost-effectively transferring micro light emitting diodes (Micro LEDs) to a target substrate in batches, given their small size and the need for millions of sub-pixels in display panels.
Innovation Solution
A mass transfer method involving the use of a transfer substrate to pick up and transfer Micro LEDs to an intermediate carrying substrate, followed by simultaneous alignment and transfer of all Micro LEDs to corresponding sub-pixels on a target substrate using light control regions and laser irradiation, with optional light control substrates like liquid crystal displays and lens layers for precise alignment and separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional batch transfer methods are used for Micro LEDs, then transfer process is simpler, but transfer efficiency is low and time-consuming
Solution Approach 1:
The transfer process is divided into multiple stages: first transferring Micro LEDs to an intermediate carrying substrate, then transferring them to the target substrate. This segmentation allows for optimized processing at each stage, improving overall transfer efficiency while managing complexity through structured workflow
Solution Approach 2:
An intermediate carrying substrate is introduced as a mediator between the source substrate and target substrate. This intermediary enables batch transfer of Micro LEDs with precise positioning, resolving the contradiction by providing a specialized transfer platform that improves efficiency without requiring direct complex positioning between source and target
2Loss of time
If individual Micro LED transfer is performed, then positioning precision is easier to achieve, but transfer time increases significantly
Solution Approach 1:
Multiple Micro LEDs are transferred simultaneously in batches rather than individually. The intermediate carrying substrate holds multiple Micro LEDs in predetermined positions, allowing parallel transfer operations that dramatically reduce total transfer time while maintaining precision through the substrate's structured design
Solution Approach 2:
Micro LEDs are pre-positioned on the intermediate carrying substrate in the correct arrangement before final transfer to the target substrate. This preliminary action ensures that when batch transfer occurs, all positioning is already prepared, enabling fast simultaneous transfer without compromising precision
3Manufacturing precision
If light control substrate is added for precise alignment, then transfer precision improves, but device structure becomes more complex
Solution Approach 1:
The light control substrate serves multiple functions: it provides precise alignment through light control regions, acts as a mask for selective transfer, and enables batch processing. This multi-functionality justifies the added structural complexity by delivering comprehensive benefits in precision and efficiency
4Productivity
If all sub-pixels receive Micro LEDs simultaneously, then production efficiency increases, but control complexity increases
Solution Approach 1:
The transfer process uses periodic light control through the light control substrate, where light control regions are activated in a controlled sequence or pattern to enable simultaneous yet selective transfer to multiple sub-pixels. This periodic control mechanism manages complexity through rhythmic, predictable control cycles
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances transfer efficiency by allowing all sub-pixels to receive Micro LEDs simultaneously, reducing time and cost, and enables the formation of high-resolution display panels.
Implementation Method 1
controlling light control regions, corresponding to the sub-pixels of the target substrate, of the light control substrate to transmit light, and controlling other light control regions to shield light
Implementation Method 2
separating micro light emitting diodes, corresponding to light-transmitting light control regions, on the intermediate carrying substrate from the intermediate carrying substrate through laser irradiation
Data Source
AI summary
A mass transfer method for micro light-emitting diodes (W) includes: picking up micro light-emitting diodes (W) on an element substrate (200) by using a transfer substrate (300), and transferring the micro light-emitting diodes (W) after pickup to an intermediate carrying substrate (400); and transferring micro light-emitting diodes (W), which are on the intermediate carrying substrate (400) and correspond to all sub-pixels (SPX) on a target substrate (100), into the sub-pixels (SPX) of the target substrate (100) at one time, such that all the sub-pixels (SPX) on the target substrate (100) receives the micro light-emitting diodes (W) at one time.