Micro LED Chip Removal Head Using Dissociation Heat

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Solution Overview

Problem

Current methods for removing defective Micro LED chips from display panels often result in damage to the chips and bonding pads, leading to contamination and impaired electrical connections, which complicates subsequent repairs.

Innovation Solution

A chip removal head equipped with a heating portion and an attractive force guide portion, where the heating portion generates dissociation heat to release the chip from the substrate, and the attractive force guide portion, such as a vacuum or magnetic force, adsorbs the chip onto the heating portion, allowing for safe removal without damaging the chip or the bonding pad.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If mechanical force is used to push off Micro LED chips, then chip removal can be achieved, but the chips and bonding pads are damaged causing contamination

Engineering Contradiction:

Improvechip removal efficiencyVSAvoidcontamination and damage

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The patent replaces the traditional mechanical pushing method with a thermal field-based removal system. The heating portion generates heat to melt the bonding material between the chip and substrate, enabling chip removal without mechanical contact. This substitution eliminates the damage and contamination caused by mechanical force while maintaining efficient chip removal capability.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the physical state of the bonding material by controlling temperature parameters. The heating portion raises the temperature to melt the bonding material, and the cooling portion subsequently cools it to solidify. This parameter change approach allows chip removal without mechanical damage to the chip or bonding pad.

Inventive Principle:

Principle #35Parameter changes

2Productivity

If laser is used to remove Micro LED chips, then chip removal can be achieved, but the chips are damaged resulting in irregular splash and contamination

Engineering Contradiction:

Improvechip removal efficiencyVSAvoidchip integrity

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent replaces laser ablation with a controlled thermal melting process. Instead of using high-energy laser to vaporize or shatter the chip, the heating portion applies controlled heat to melt only the bonding material, preserving chip integrity. The chip is then gently lifted by the attractive force guide portion without irregular splashing.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces an intermediary mechanism - the attractive force guide portion - that mediates between the heating process and chip removal. This intermediary component uses magnetic or electrostatic attraction to gently hold and lift the chip after bonding material melting, preventing direct contact and damage that would occur with mechanical or laser methods.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Productivity

If external force is applied to remove chips, then chip removal can be achieved, but bonding pads are damaged affecting subsequent repairs

Engineering Contradiction:

Improvechip removal efficiencyVSAvoidbonding pad integrity

Core Design Contradiction:

ProductivityVSEase of repair

Solution Approach 1:

The patent applies local quality by concentrating the heating action only at the bonding interface between the chip and substrate. The heating portion is positioned to deliver heat precisely where the bonding material exists, melting only the adhesive without affecting the bonding pad structure. This localized thermal treatment preserves the bonding pad for subsequent repairs while enabling chip removal.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables the removal of defective Micro LED chips without damaging them or the corresponding bonding pads, preventing contamination and ensuring that subsequent repairs can be performed normally, with a simple and efficient control process.

Implementation Method 1

the heating portion is connected to an external power supply, and generates a dissociation heat under the action of the external power supply

Methodology Applied

Scientific EffectResistive heating: Joule Heating

Implementation Method 2

the attractive force guide portion is configured to guide the to-be-removed chip, for which the connection has been released, to be adsorbed on the bottom surface of the heating portion

Methodology Applied

Scientific EffectAttractive force: Magnetism

Data Source

PatentUS20230053040A1Chip Removal Head, Chip Removal System and Chip Removal Method

Publication Date: 2023.02.16 CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD

AI summary

The present application relates to a chip removal head, a chip removal system and a chip removal method. The chip removal head has a heating portion (14) and an attractive force guide portion, wherein the heating portion (14) includes a bottom surface (141) and a top surface (142), which are opposite to each other, and the bottom surface (141) is a surface in contact with a to-be-removed chip; the heating portion (14) is connected to an external power supply, and generates a dissociation heat under the action of the external power supply, so as to release a connection between the to-be-removed chip and an external substrate; and the attractive force guide portion is configured to guide the to-be-removed chip, for which the connection has been released, to be adsorbed on the bottom surface (141) of the heating portion (14).