Micro LED Chip Transfer via Electrostatic Suspension in Insulating Fluid
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Solution Overview
Problem
The existing micro transfer printing (μTP) technology for transferring Micro LED chips has a low transfer efficiency, leading to higher costs due to the limited number of chips that can be picked up and transferred at one time, making it inefficient for large-scale industrial applications.
Innovation Solution
A chip transfer method using an insulating fluid in combination with electrostatic adsorption, where a target substrate with alignment bonding structures is used, and the chip with bonding structures is suspended and aligned within a closed cavity, allowing for precise bonding of the chip to the target substrate, enhancing transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If micro transfer printing (μTP) technology is used to transfer Micro LED chips, then the transfer process can be completed, but the transfer efficiency is low and the number of chips that can be picked up and transferred at one time is limited
Solution Approach 1:
The chip bonding structure is divided into multiple independent bonding areas (first chip bonding structure and second chip bonding structure), allowing multiple chips to be transferred simultaneously. The target substrate is also segmented with corresponding alignment bonding structures that enable parallel processing of multiple chips, thereby improving transfer efficiency while maintaining manageable device complexity
Solution Approach 2:
Multiple chip bonding structures are combined into a single integrated chip design, and multiple alignment bonding structures are combined on the target substrate. This merging approach allows simultaneous transfer of multiple chips in one operation, significantly improving productivity without proportionally increasing device complexity
2Manufacturing precision
If traditional transfer methods are used, then the process is simple, but the transfer precision and alignment accuracy are insufficient
Solution Approach 1:
Alignment bonding structures are pre-formed on both the chip and target substrate before the transfer process. These pre-configured structures establish precise alignment relationships in advance, ensuring high manufacturing precision during transfer while avoiding the need for complex real-time alignment mechanisms
Solution Approach 2:
The alignment bonding structures serve as intermediary elements that mediate between the chip bonding structures and the target substrate. These intermediaries enable precise alignment and bonding by providing dedicated alignment features that simplify the overall transfer process and improve manufacturing precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves the transfer efficiency of Micro LED chips, reducing transfer costs and enabling high-precision batch transfers, thus overcoming the limitations of the μTP technology.
Implementation Method 1
A chip transfer method using an insulating fluid in combination with electrostatic adsorption, where a target substrate with alignment bonding structures is used, and the chip with bonding structures is suspended and aligned within a closed cavity
Data Source
AI summary
A chip transfer method including: disposing a target substrate in a closed cavity, the target substrate including a first alignment bonding structure and a second alignment bonding structure; applying a charge of a first polarity to the first alignment bonding structure of the target substrate; applying a charge of a second polarity to a first chip bonding structure of a chip; injecting an insulating fluid into the closed cavity to suspend the chip in the insulating fluid within the closed cavity; and applying a bonding force to the chip.