Micro LED Coincident Electrode Thermal Management
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Solution Overview
Problem
The manufacturing process of micro LED display panels is complex due to the small size of micro light emitting diode chips, and thermal energy generated during operation affects the electrical characteristics of micro LEDs, necessitating effective heat dissipation solutions.
Innovation Solution
A micro light emitting diode design with a coincident first and second electrode structure that allows for efficient heat transfer and stable bonding to a display panel, featuring a thicker first electrode and a trapezoidal epitaxial stack layer for improved thermal management and manufacturing simplicity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If micro light emitting diode chips are used for display panels, then high efficiency and high resolution are achieved, but manufacturing complexity increases
Solution Approach 1:
The invention segments the manufacturing process into two distinct stages: first, mass-producing LED chips on a large substrate using conventional techniques; second, transferring individual chips to the display panel using transfer printing technology. This segmentation allows each stage to be optimized independently, reducing overall manufacturing complexity while maintaining high resolution capabilities.
Solution Approach 2:
The invention introduces a transfer printing intermediary system that acts as a bridge between conventional LED manufacturing and display panel assembly. This intermediary process uses a transfer substrate with adhesive layers to pick up and place micro LED chips precisely, simplifying the integration of small chips into display panels without requiring entirely new manufacturing equipment.
2Manufacturing precision
If micro light emitting diode chips with small size are used, then high resolution is achieved, but heat dissipation becomes more difficult
Solution Approach 1:
The invention transitions heat dissipation from a two-dimensional planar approach to a three-dimensional vertical approach by growing LED chips vertically on substrates and using transfer printing to maintain optimal chip-to-panel spacing. This dimensional change creates additional thermal pathways and prevents heat accumulation that would occur with densely packed flat-mounted chips.
Solution Approach 2:
The invention extracts the heat dissipation function from the chip itself by implementing a separate thermal management system at the panel level. The display panel structure includes dedicated thermal management layers and heat sinks that are independent of the micro LED chip design, allowing efficient heat removal without compromising chip miniaturization.
3Use of energy by moving object
If micro light emitting diode chips are used, then high efficiency is achieved, but thermal energy affects electrical characteristics
Solution Approach 1:
The invention implements thermal management structures and heat dissipation pathways in advance during display panel fabrication, before the micro LED chips are fully operational. This preemptive approach creates thermal buffers and cooling channels that prevent temperature-induced electrical characteristic drift before it occurs, ensuring stable performance throughout operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances cooling efficiency, electrical characteristics, and manufacturing ease, resulting in a more stable and efficient micro LED display panel with improved production yield.
Implementation Method 1
the lower surface of the first electrode substantially coincides with the upper surface of the first semiconductor layer, and the upper surface of the second electrode substantially coincides with the lower surface of the second semiconductor layer... can rapidly transfer heat to the outside
Data Source
AI summary
A micro LED including an epitaxial stack layer, a first electrode and a second electrode is provided. A lower surface of the first electrode is in contact with an upper surface of a first semiconductor layer of the epitaxial stack layer. An upper surface of the second electrode is in contact with a lower surface of a second semiconductor layer of the epitaxial stack layer. The lower surface of the first electrode substantially coincides with the upper surface of the first semiconductor layer. The upper surface of the second electrode substantially coincides with the lower surface of the second semiconductor layer. Furthermore, a display panel is also provided.