Micro LED Display Panel with Anisotropic Conductive Connection Layer
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Solution Overview
Problem
Micro LED displays are prone to damage due to inability to withstand lateral stress or stress from opposite sides of electrodes during the manufacturing process, limiting their reliability and performance.
Innovation Solution
The use of a connection layer with anisotropic conductive particles and metal pads forming a metal retaining wall to distribute stress evenly, reducing the risk of micro LED breakage by embedding second metal electrodes in the connection layer and positioning metal pads around each micro LED to enhance structural strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If micro LEDs are directly mounted on electrodes during manufacturing, then the display achieves high brightness and ultra-high resolution, but the micro LEDs are damaged due to inability to withstand lateral stress or stress from opposite sides of electrodes
Solution Approach 1:
The patent introduces a connection layer as an intermediary between the micro LED and the electrode. This connection layer includes a first metal layer, an organic layer, and a second metal layer, which collectively serve as a stress-absorbing buffer that protects the micro LED from lateral stress and electrode stress while maintaining electrical connection
Solution Approach 2:
The connection layer employs a composite structure combining metal layers (for electrical conductivity and mechanical strength) with an organic layer (for stress absorption and flexibility). This composite material design enables the connection layer to simultaneously provide electrical connection and mechanical protection against stress
2Reliability
If the connection layer uses conventional isotropic conductive particles, then manufacturing is simpler, but stress distribution is uneven causing micro LED breakage
Solution Approach 1:
The patent employs anisotropic conductive particles with different physical properties in different directions within the connection layer. These particles exhibit directional conductivity and stress distribution characteristics, providing enhanced stress distribution uniformity in critical directions while maintaining overall structural integrity
Solution Approach 2:
The patent changes the physical and chemical parameters of the conductive particles by using anisotropic particles instead of conventional isotropic ones. This parameter change enables the particles to distribute stress more uniformly in specific directions, preventing micro LED breakage while managing connection layer complexity
3Area of stationary object
If metal pads are positioned close to micro LEDs for compact design, then device area is reduced, but stress concentration increases causing micro LED damage
Solution Approach 1:
The connection layer serves as a mediator between the metal pads and micro LEDs. Even when metal pads are positioned close to micro LEDs for compact design, the connection layer's stress-absorbing capability prevents stress concentration from reaching the micro LED, thereby maintaining both compactness and structural strength
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces stress on micro LEDs, preventing breakage and enhancing the structural integrity and reliability of micro LED display panels, thereby improving their manufacturing process and performance.
Implementation Method 1
The use of a connection layer with anisotropic conductive particles and metal pads forming a metal retaining wall to distribute stress evenly, reducing the risk of micro LED breakage
Implementation Method 2
The connection layer contains solder material including a plurality of conductive particles, and each second metal electrode is electrically connected to one of the first metal electrodes by the conductive particles
Data Source
AI summary
A micro LED display panel includes a substrate, a plurality of first metal electrodes and a plurality of metal pads on a surface of the substrate, a connection layer on the substrate, a plurality of micro LEDs on a side of the connection layer away from the substrate. The connection layer includes conductive particles. Each of the micro LEDs is coupled to at least one of the first metal electrode. A side of each of the metal pads away from the substrate is coupled to some of the conductive particles in the connection layer to form a metal retaining wall. The metal retaining walls enhance structural strength of the micro LED display panel and avoid breakage of any of the micro LEDs.