Micro-LED Electrode Contact Layout for Higher Display Yield
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Solution Overview
Problem
The existing methods for manufacturing micro-LED display apparatuses face challenges with low yield rates and increased repair needs due to the decrease in micro-LED size and increase in display size, particularly when using the pick and place method for transferring micro-LEDs.
Innovation Solution
A micro-LED display apparatus design that includes a driving circuit substrate with a first electrode, micro-LEDs, an insulating layer, a via pattern exposing the micro-LEDs, electrical contacts, and a second electrode, where the electrical contacts have a thickness corresponding to the distance between the insulating layer and the micro-LEDs, and are arranged in patterns such as dotted, stripe, or grid patterns, ensuring reliable connection and reducing the need for repairs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the pick and place method is used to transfer micro-LEDs, then the manufacturing process is simple, but the yield rate decreases when micro-LED size decreases and display size increases
Solution Approach 1:
The patent replaces the mechanical pick and place transfer method with a direct growth method where micro-LEDs are grown directly on the substrate in their final positions. This eliminates the transfer step that causes yield loss, while maintaining manufacturing simplicity through a direct epitaxial growth process.
2Ease of manufacture
If the pick and place method is used to transfer micro-LEDs, then the manufacturing process is simple, but the repair rate increases
Solution Approach 1:
By replacing the mechanical transfer process with direct growth, the patent eliminates the physical handling and placement steps that can cause micro-LED damage or misalignment, thereby reducing the need for repairs while keeping the manufacturing process simple.
3Measurement precision
If micro-LED size decreases and display size increases, then the display resolution improves, but the yield rate decreases
Solution Approach 1:
The direct growth method allows micro-LEDs to be formed in-situ at their precise final locations with high precision, enabling smaller micro-LED sizes and higher display resolutions without the yield penalties associated with mechanical transfer and placement of tiny components.
4Quantity of substance
If the number of micro-LEDs increases, then the display quality improves, but the need for high-speed transfer and reduced repair rate increases
Solution Approach 1:
By eliminating the transfer step entirely through direct growth, the patent removes the bottleneck of high-speed transfer requirements. Micro-LEDs are formed directly in their final positions, allowing the number of micro-LEDs to increase without proportionally increasing transfer speed demands.
Data Source
AI summary
The present disclosure provides a micro-light-emitting diode display apparatus and a method of manufacturing the same. Provided is a micro-light-emitting diode (LED) display apparatus including a plurality of pixels, the micro-LED display apparatus including a driving circuit substrate, a first electrode provided on the driving circuit substrate, one or more micro-light-emitting diodes (LEDs) provided on the first electrode, an insulating layer provided on the one or more micro-LEDs, a via pattern provided in the insulating layer, electrical contacts provided in the via pattern, and a second electrode provided on the electrical contacts, wherein the via pattern exposes a portion of the one or more micro-LEDs.