Micro LED Package Structure for High-Contrast Display Emission
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Solution Overview
Problem
LED displays with red, green, and blue LED elements face challenges in achieving high luminance and contrast ratios due to extraneous light reflection, which reduces their performance in various environments.
Innovation Solution
A light emitting diode package comprising a substrate, micro LED chips, a black material layer, and a transparent material layer, where the micro LED chips include a first and second semiconductor layer with a rough light emitting surface and a supporting breakpoint, and a pixel controller to control the blue, green, and red micro LED chips, optimized with a black material layer to reduce internal reflection and enhance contrast.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If LED displays use red, green, and blue LED elements to achieve high luminance, then the luminance is improved, but extraneous light reflection reduces the contrast ratio
Solution Approach 1:
The patent applies anti-reflective coatings and black matrix materials that convert harmful reflected light into beneficial effects by absorbing or eliminating the reflected extraneous light, thereby improving contrast ratio while maintaining high luminance from the LED elements
Solution Approach 2:
The patent implements localized anti-reflective treatments specifically at critical reflection zones around the LED elements, using black matrices and selective coating applications to address reflection problems only where they occur most severely, preserving overall display luminance while improving local contrast
2Area of stationary object
If the substrate width is increased to accommodate more LED chips, then the display area is improved, but the ratio of substrate width to transparent material layer thickness decreases
Solution Approach 1:
The patent addresses the dimensional constraint by optimizing the vertical layer structure (transparent material layer thickness) to compensate for increased horizontal substrate width, maintaining the required optical path length and light extraction efficiency despite larger display area
Solution Approach 2:
The patent adjusts the thickness parameter of the transparent material layer in proportion to the substrate width increase, maintaining the critical ratio parameter (substrate width to transparent material layer thickness ratio ≥ 4) to ensure proper light extraction and display performance across different display sizes
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly reduces side emission compared to top emission, enhancing the contrast ratio and luminance of LED displays while minimizing false lighting from extraneous reflections.
Implementation Method 1
the light emitting surface has a rough texture
Implementation Method 2
The black material layer covers the top surface of the substrate to expose the plurality of micro LED chips
Data Source
AI summary
A light emitting diode (LED) package includes a substrate, at least one micro LED chip, a black material layer, and a transparent material layer. The substrate has a width ranging from 100 micrometers to 1000 micrometers. The at least one micro LED chip is electrically mounted on a top surface of the substrate and has a width ranging from 1 micrometer to 100 micrometers. The black material layer covers the top surface of the substrate to expose the at least one micro LED chip. The transparent material layer covers the at least one micro LED chip and the black material layer.