Micro LED Package Structure for High-Contrast Display Panels
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Solution Overview
Problem
LED displays face challenges in maintaining high contrast ratios due to extraneous light reflection, which reduces their effectiveness in environments with ambient lighting.
Innovation Solution
A light emitting diode package design incorporating a substrate, micro LED chips, a black material layer, a transparent material layer, and a pixel controller, with specific dimensions and configurations to minimize side emissions and enhance contrast ratios.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If LED displays use conventional structures without black material layer, then manufacturing is simpler, but extraneous light reflection reduces contrast ratio
Solution Approach 1:
A black material layer is introduced as an intermediary component between the substrate and the transparent material layer. This black material layer specifically targets and absorbs extraneous light reflections, preventing them from reaching the viewer and reducing false lighting effects, thereby improving contrast ratio without complicating the manufacturing process
2Device complexity
If micro LED chips are mounted without black material coverage, then device complexity is reduced, but side emissions increase and contrast ratio decreases
Solution Approach 1:
The black material layer, which initially appears to add complexity, actually converts the harmful side emissions and reflections into absorbed energy, transforming a negative effect into a beneficial outcome by improving contrast ratio and display quality
3Manufacturing precision
If transparent material layer thickness is reduced, then manufacturing precision requirements are lowered, but side emissions increase and contrast ratio decreases
Solution Approach 1:
The invention optimizes the thickness parameter of the transparent material layer to a specific range (10-100 micrometers). This parameter change achieves an optimal balance where the layer is thick enough to provide structural support and reduce side emissions, yet thin enough to maintain manufacturing feasibility and cost-effectiveness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves higher luminance and contrast ratios by reducing side emissions and minimizing extraneous light reflection, thereby improving display performance.
Implementation Method 1
The black material layer covers the top surface of the substrate to expose the plurality of micro LED chips
Implementation Method 2
The transparent material layer covers the plurality of micro LED chips and the black material layer
Implementation Method 3
The plurality of micro LED chips include a blue micro LED chip, a green micro LED chip, and a red micro LED chip
Implementation Method 4
Each micro LED chip includes a first semiconductor layer with a light emitting surface exposed outside
Data Source
AI summary
A light emitting diode (LED) package includes a substrate, at least one micro LED chip, a black material layer, and a transparent material layer. The substrate has a width ranging from 100 micrometers to 1000 micrometers. The at least one micro LED chip is electrically mounted on a top surface of the substrate and has a width ranging from 1 micrometer to 100 micrometers. The black material layer covers the top surface of the substrate to expose the at least one micro LED chip. The transparent material layer covers the at least one micro LED chip and the black material layer.