Micro LED Light-Shielding Layer Formation to Prevent Cross Color
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Solution Overview
Problem
The existing manufacturing processes for micro light-emitting diode (LED) displays are complex and result in a light-shielding layer with poor light-shielding ability and a high likelihood of cross color between adjacent micro LEDs, particularly when using liquid epoxy resin and carbon-containing materials.
Innovation Solution
A method involving the formation of a first adhesive material layer on micro LEDs, which is then irradiated with light using a photoresist layer as a mask to create a light-shielding layer, simplifying the process and improving the light-shielding ability while preventing cross color by forming a black or transparent layer between adjacent micro LEDs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple packaging and delamination steps are used to form the light-shielding layer, then the light-shielding layer can be formed, but the manufacturing process becomes complex
Solution Approach 1:
The patent combines the adhesive material layer formation and light-shielding layer formation into a single integrated process. The adhesive material layer is formed first, then patterned through photolithography to simultaneously create both the adhesive structure and the light-shielding pattern, eliminating the need for separate packaging and delamination steps while maintaining effective light-shielding capability
Solution Approach 2:
The patent applies the light-shielding pattern to the adhesive material layer before final curing. By using photolithography to pattern the adhesive material layer while it is still in a workable state, the light-shielding structure is created in advance during the same process cycle as adhesive formation, avoiding subsequent complex manufacturing steps
2Ease of manufacture
If liquid epoxy resin and carbon-containing material are used for the light-shielding layer, then the light-shielding layer can be formed, but the light-shielding ability is poor and cross color occurs easily
Solution Approach 1:
The patent changes the material parameters by using an inorganic light-shielding material (such as metal oxide or metal nitride) instead of organic epoxy resin with carbon-containing material. This material substitution provides superior light-shielding properties and prevents cross-color issues while maintaining ease of formation through standard sputtering or atomic layer deposition processes
Solution Approach 2:
The patent creates a composite structure where the inorganic light-shielding material is integrated with the adhesive material layer. The light-shielding layer is formed as a distinct inorganic layer that works synergistically with the organic adhesive layer, combining the benefits of strong adhesion with excellent light-shielding performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method simplifies the formation of a light-shielding layer, enhances its light-shielding ability, and effectively prevents cross color between adjacent micro LEDs, thereby improving the light-emitting effect and reducing color shift.
Implementation Method 1
A first adhesive material layer is formed on the multiple micro LEDs. A region between adjacent micro LEDs is filled with the first adhesive material layer. A light-shielding layer is formed between the adjacent micro-LEDs by irradiating the first adhesive material layer with a light.
Implementation Method 2
A first photoresist layer is formed on the first adhesive material layer. The first photoresist layer covers the multiple micro LEDs. The first adhesive material layer is irradiated with a light by using the first photoresist layer as a mask, to make the first adhesive material layer irradiated become black to form the light-shielding layer.
Data Source
AI summary
A manufacturing method of a micro light-emitting diode (LED) display and a micro LED display are provided in the present disclosure, and the method includes the following. A display substrate is provided. Multiple micro LEDs are disposed on the display substrate. A first adhesive material layer is formed on the multiple micro LEDs. A region between adjacent micro LEDs is filled with the first adhesive material layer. A light-shielding layer is formed between the adjacent micro-LEDs by irradiating the first adhesive material layer with a light.