Micro LED Molding Structure for Crosstalk Control and Light Directivity

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Solution Overview

Problem

The manufacturing process of micro LED display panels faces challenges in improving light directivity and transmittance due to the limitations of existing light-shielding layers, which require high temperature and circuit protection, and result in poor transparency and limited thickness.

Innovation Solution

The proposed solution involves a display panel design with a circuit substrate and micro light-emitting diode structures, where a molding structure surrounds the micro light-emitting chip and extends to the first surface, preventing crosstalk and improving light directivity. The molding structure can be adjusted in thickness by modifying the connecting layer height, allowing for better light transmittance and product yield.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Illumination intensity

If a light-shielding layer is manufactured on the circuit substrate to prevent crosstalk, then light directivity is improved, but the process becomes complex due to high temperature and circuit protection requirements

Engineering Contradiction:
Improvelight directivityVSAvoidmanufacturing process complexity
Core Design Contradiction:
Illumination intensityVSDevice complexity

Solution Approach 1:

Instead of forming the light-shielding layer after transferring micro LEDs to the circuit substrate, the invention inverts the sequence by forming the light-shielding layer on the carrier substrate before transfer. This allows the light-shielding layer to be created under simpler conditions without circuit protection requirements, while still achieving the desired light directivity function.

Inventive Principle:
Principle #13The other way round (Inversion)

Solution Approach 2:

The light-shielding layer is formed in advance on the carrier substrate before the micro LEDs are transferred to the circuit substrate. This preliminary action enables the light-shielding structure to be prepared under less restrictive conditions, avoiding the need for high temperature and circuit protection processes that would be required if formed later.

Inventive Principle:
Principle #10Preliminary action

2Object-affected harmful factors

If a light-shielding layer completely covers the gaps between sub-pixels, then crosstalk is prevented, but light transmittance of the display panel deteriorates

Engineering Contradiction:
Improvecrosstalk preventionVSAvoidlight transmittance
Core Design Contradiction:
Object-affected harmful factorsVSIllumination intensity

Solution Approach 1:

The light-shielding layer is designed with spatially varying properties: it is formed only in specific regions corresponding to the gaps between sub-pixels where crosstalk prevention is needed, while leaving the light-emitting regions of each sub-pixel uncovered. This local differentiation allows crosstalk prevention without compromising light transmittance from the emitting areas.

Inventive Principle:
Principle #3Local quality

3Object-affected harmful factors

If the light-shielding layer has relatively great thickness, then crosstalk prevention is improved, but photolithography exposure becomes unsmooth and manufacturing is limited

Engineering Contradiction:
Improvecrosstalk preventionVSAvoidphotolithography exposure quality
Core Design Contradiction:
Object-affected harmful factorsVSManufacturing precision

Solution Approach 1:

The light-shielding layer is formed on the carrier substrate before micro LED transfer, allowing sufficient thickness to be achieved for effective crosstalk prevention. The preliminary formation on the carrier substrate avoids the photolithography limitations that would occur if the same thick layer were formed after transfer to the circuit substrate.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS20250192120A1Display panel and manufacturing method thereof
Publication Date: 2025.06.12 PLAYNITRIDE DISPLAY CO LTD
  • US20250192120A1 patent drawing
  • US20250192120A1 patent drawing
  • US20250192120A1 patent drawing

AI summary

A display panel and a manufacturing method thereof are provided. The display panel includes a circuit substrate and a plurality of micro light-emitting diode structures. The micro light-emitting diode structures each include a micro light-emitting chip and a molding structure. The micro light-emitting chip is electrically bonded to the circuit substrate, and includes a first surface, a second surface, and a peripheral surface. The first surface is located on a side of the micro light-emitting chip facing the circuit substrate. The second surface is disposed opposite to the first surface. The peripheral surface connects the first surface and the second surface. The molding structure surrounds the peripheral surface and encloses the second surface of the micro light-emitting chip. The molding structure extends in a direction away from the circuit substrate and forms an inner side wall. The inner side wall and the second surface constitute an accommodating portion.