Micro LED Molding Structure for Crosstalk Control and Light Output
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Solution Overview
Problem
The existing manufacturing process for micro LED display panels faces challenges in improving light directivity and transmittance due to the need for a light-shielding layer that is non-transparent and requires complex high-temperature processes, limiting product yield and increasing costs.
Innovation Solution
The proposed solution involves a display panel design with a molding structure that extends around the micro light-emitting chip, forming an accommodating portion with the chip's second surface. This design improves light directivity by preventing crosstalk between adjacent micro LEDs and enhances light transmittance by not fully covering the circuit substrate. Additionally, the molding structure can be adjusted in thickness by modifying the connecting layer height, allowing for thicker structures beyond photolithography limitations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a light-shielding layer is manufactured on the circuit substrate to prevent crosstalk, then light directivity is improved, but the process becomes complex due to high temperature and circuit protection requirements
Solution Approach 1:
The patent extracts the light-shielding function from the circuit substrate and relocates it to the molding structure surrounding the micro light-emitting chip. This separates the light-shielding layer from the circuit substrate, eliminating the need for complex high-temperature processes and circuit protection measures while maintaining effective light directivity control.
Solution Approach 2:
The molding structure serves as an intermediary element that performs the light-shielding function without requiring direct manufacturing on the circuit substrate. By using the molding structure as a mediator, the patent avoids the technical conflicts between light-shielding requirements and circuit substrate constraints.
2Illumination intensity
If the light-shielding layer has a relatively great thickness, then crosstalk prevention is improved, but photolithography exposure becomes unsmooth and manufacturing is limited
Solution Approach 1:
The patent replaces the photolithography-based light-shielding layer manufacturing with a molding process. This substitution eliminates the photolithography exposure limitations and allows for the creation of thicker light-shielding structures without compromising manufacturing precision or exposure quality.
Data Source
AI summary
A display panel and a manufacturing method thereof are provided. The display panel includes a circuit substrate and a plurality of micro light-emitting diode structures. The micro light-emitting diode structures each include a micro light-emitting chip and a molding structure. The micro light-emitting chip is electrically bonded to the circuit substrate, and includes a first surface, a second surface, and a peripheral surface. The first surface is located on a side of the micro light-emitting chip facing the circuit substrate. The second surface is disposed opposite to the first surface. The peripheral surface connects the first surface and the second surface. The molding structure surrounds the peripheral surface and encloses the second surface of the micro light-emitting chip. The molding structure extends in a direction away from the circuit substrate and forms an inner side wall. The inner side wall and the second surface constitute an accommodating portion.