Micro LED Diffusion Structure for Uniform Current Injection

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Solution Overview

Problem

Micro light-emitting diode chips experience low internal quantum efficiency due to high local current density and non-uniform current distribution, primarily because carriers recombine near the contact layer and semiconductor layer interface.

Innovation Solution

A micro light-emitting device structure is designed with a diffusion structure on the second-type semiconductor layer, which has lower conductivity than the semiconductor layer, forcing current to diffuse over a larger area, thereby increasing current density uniformity and improving internal quantum efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If carriers flow directly to the recombination region near the contact layer interface, then the current density becomes concentrated in a small area, but this results in high local current density and low internal quantum efficiency

Engineering Contradiction:
Improveinternal quantum efficiencyVSAvoidcurrent density uniformity
Core Design Contradiction:
ReliabilityVSEase of operation

Solution Approach 1:

The patent applies local quality by introducing a diffusion structure with specific conductivity properties at a particular location (second-type semiconductor layer) to create non-uniform current distribution that ultimately achieves uniform current density across the active layer, improving internal quantum efficiency

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The diffusion structure acts as an intermediary element between the contact layer and the active layer, mediating the carrier flow to prevent direct concentration at the interface and instead distribute carriers uniformly across the active layer through controlled diffusion

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If the diffusion structure has lower conductivity than the second-type semiconductor layer, then current diffusion is enhanced and uniformity improves, but this requires additional structural complexity

Engineering Contradiction:
Improvecurrent density uniformityVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent changes the conductivity parameter of the diffusion structure to be lower than that of the second-type semiconductor layer, which controls the current diffusion behavior and achieves uniform current density distribution across the active layer, thereby improving internal quantum efficiency

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design effectively blocks direct carrier flow to the recombination region, enhancing current diffusion and resulting in improved internal quantum efficiency and display quality.

Implementation Method 1

A conductivity of the diffusion structure is less than a conductivity of the second-type semiconductor layer

Methodology Applied
Scientific EffectElectrical Resistance: Electrical Resistance

Implementation Method 2

forcing the current to diffuse to a larger range, thereby increasing the uniformity of the current density

Methodology Applied
Scientific EffectDiffusion: Diffusion

Data Source

PatentUS20240413277A1Micro light-emitting device and micro light-emitting device structure
Publication Date: 2024.12.12 PLAYNITRIDE DISPLAY CO LTD
  • US20240413277A1 patent drawing
  • US20240413277A1 patent drawing
  • US20240413277A1 patent drawing

AI summary

A micro light-emitting device includes an epitaxial structure, a first electrode, a second electrode, a first contact layer and a diffusion structure. The epitaxial structure includes a first-type semiconductor layer, an active layer and a second-type semiconductor layer stacked in sequence. The second-type semiconductor layer has an outer surface relatively away from the first-type semiconductor layer. The first and second electrodes are respectively disposed on the epitaxial structure and electrically connected to the first-type and the second-type semiconductor layers. The first contact layer is disposed between the first electrode and the first-type semiconductor layer. The diffusion structure is disposed on a side of the second-type semiconductor layer away from the first-type semiconductor layer. A conductivity of the diffusion structure is less than that of the second-type semiconductor layer. The outer surface of the second-type semiconductor layer exposes a lower surface of the diffusion structure away from the first-type semiconductor layer.