Micro LED Mesa Layout for Current Spreading and Red-Shift Control
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Solution Overview
Problem
Micro LEDs face issues such as red-shift, low maximum efficiency, and inhomogeneous emission due to high current density, nonradiative recombination at improperly etched quantum well sidewalls, and electron leakage, which decrease external and internal quantum efficiencies and lead to reliability and accuracy problems.
Innovation Solution
A micro LED structure with a mesa design featuring a first semiconductor layer, a light emitting layer, and a second semiconductor layer, along with a sidewall protective and reflective layer, where the top surface area of the second semiconductor layer is greater than the other surface areas, and an ion implantation region with higher resistance is formed around the semiconductor region to optimize current injection and reduce current density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If space is formed between adjacent micro LEDs to avoid carrier spreading, then carrier isolation is improved, but active light emitting area is reduced and light extraction efficiency decreases
Solution Approach 1:
The patent applies local quality by creating an asymmetric mesa structure where the second semiconductor layer has a larger top surface area than the first semiconductor layer. This localized geometric modification allows carriers to be confined within the expanded area of the second layer, providing carrier isolation without requiring spacing between adjacent micro LEDs. The non-uniform area distribution resolves the contradiction by maintaining both carrier isolation and maximizing active light emitting area.
2Area of stationary object
If space between adjacent mesas is eliminated to increase active light emitting area, then active light emitting area is improved, but carrier spreading across adjacent mesas occurs reducing light emitting efficiency
Solution Approach 1:
The patent uses local quality by modifying the mesa structure to have an asymmetric area distribution between the first and second semiconductor layers. The second layer's larger top surface area creates a localized carrier confinement zone that prevents carrier spreading to adjacent mesas, even when mesas are placed in close proximity. This resolves the contradiction by maintaining both large active area and high light emitting efficiency through structural design rather than spacing.
3Reliability
If ion implantation region with higher resistance is formed around semiconductor region, then current density is reduced and current injection is optimized, but device complexity increases
Solution Approach 1:
The patent applies merging by integrating the ion implantation region directly into the semiconductor layer structure during the epitaxial growth process. The ion implantation region is formed as an inherent part of the second semiconductor layer, combining the light emitting function and current management function in a single integrated structure. This resolves the contradiction by achieving optimized current injection without adding separate complex components or structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances light emitting efficiency, reduces red-shift, and improves the external and internal quantum efficiencies, leading to increased reliability and accuracy of micro LEDs.
Implementation Method 1
an ion implantation region with higher resistance is formed around the semiconductor region to optimize current injection and reduce current density
Implementation Method 2
a sidewall reflective layer formed on the surface of the sidewall protective layer
Data Source
AI summary
A micro light emitting diode (LED) structure, includes a mesa structure. The mesa structure further includes a first semiconductor layer having a first conductive type, a light emitting layer formed on the first semiconductor layer, a second semiconductor layer formed on the light emitting layer, the second semiconductor layer having a second conductive type different from the first conductive type. A top surface area of the second semiconductor layer is greater than each of: a bottom surface area of the first semiconductor layer, a top surface area of the first semiconductor layer, and a bottom surface area of the second semiconductor layer. The second semiconductor layer further includes a semiconductor region and an ion implantation region formed around the semiconductor region, the ion implantation region having a resistance higher than a resistance of the semiconductor region.


