Micro LED Panel DBR Isolation Structure Without Metal Reflector
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Solution Overview
Problem
Conventional micro LED display panels require a metal reflective layer to improve light emission efficiency, which increases costs and can lead to metal migration issues.
Innovation Solution
A micro LED display panel design that eliminates the need for a metal reflective layer by using a non-metal reflective isolation layer with a dielectric distributed Bragg reflection (DBR) structure, which enhances light reflection and prevents metal migration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If a metal reflective layer is used to improve light emission efficiency, then light emission efficiency is improved, but costs increase and metal migration issues occur
Solution Approach 1:
The patent removes the metal reflective layer from the micro LED display panel structure. By extracting this problematic component, the invention eliminates metal migration issues and cost increases while maintaining light emission efficiency through the dielectric DBR structure instead.
Solution Approach 2:
The patent replaces the metal reflective layer (mechanical/material-based solution) with a dielectric distributed Bragg reflection (DBR) structure. This substitution uses optical interference principles in dielectric layers to achieve light reflection without the harmful effects of metal materials.
2Use of energy by moving object
If a metal reflective layer is used to improve light emission efficiency, then light emission efficiency is improved, but costs increase
Solution Approach 1:
The patent removes the metal reflective layer from the micro LED display panel structure. By extracting this problematic component, the invention eliminates metal migration issues and cost increases while maintaining light emission efficiency through the dielectric DBR structure instead.
Solution Approach 2:
The patent changes the material parameters from metal to dielectric materials in the reflective structure. This parameter change enables the same optical function (light reflection) to be achieved with different material properties that are more cost-effective and reliable.
3Reliability
If a non-metal reflective isolation layer with dielectric DBR structure is used to eliminate metal reflective layer, then costs are reduced and metal migration is prevented, but light reflection capability must be enhanced to over 99%
Solution Approach 1:
The patent divides the reflective isolation layer into multiple alternating dielectric layers with different refractive indices, forming a distributed Bragg reflection structure. This segmentation into multiple thin layers creates constructive interference for light reflection, achieving over 99% reflectivity without using metal materials.
Solution Approach 2:
The patent uses a composite structure of multiple dielectric materials with different optical properties (refractive indices) to create the DBR structure. This composite approach combines materials like silicon dioxide and titanium dioxide in alternating layers to achieve superior optical performance that neither material could provide alone.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves light emitting efficiency, reduces costs by eliminating the metal reflective layer, and enhances display brightness with a reflectivity of over 99%, while preventing metal migration issues.
Implementation Method 1
a reflective isolation layer filled in a space between the adjacent mesa structures, a bottom of the reflective isolation layer being lower than a bottom of the mesa structure
Implementation Method 2
The solution improves light emitting efficiency, reduces costs by eliminating the metal reflective layer, and enhances display brightness with a reflectivity of over 99%
Data Source
AI summary
A micro LED display panel includes a mesa array including a plurality of mesa structures; a top transparent conductive layer formed on a top surface of the mesa array; a reflective isolation layer filled in a space between the adjacent mesa structures, a bottom of the reflective isolation layer being lower than a bottom of the mesa structure; and an integrated circuit (IC) backplane formed at a bottom of the reflective isolation layer.


