Transparent Repair Substrate for Micro LED Defect Bypass

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Solution Overview

Problem

Existing micro LED repair methods are costly and labor-intensive due to the need for delicate removal and replacement of defective LEDs, which requires careful handling to avoid damaging interconnect patterns.

Innovation Solution

A display device and repair method where a second transparent substrate with a repair LED is stacked on the first substrate, allowing the defective LED to be bypassed without removal, simplifying the repair process and reducing costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the defective micro LED is removed by heating with a laser, then the defective LED can be eliminated, but the interconnect pattern may be damaged and the repair process becomes complex and costly

Engineering Contradiction:
Improvedefective LED eliminationVSAvoidrepair process complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent extracts only the necessary repair functionality by stacking a second substrate with repair LEDs directly over the first substrate, eliminating the need to remove defective LEDs through complex laser heating processes. The repair LEDs are selectively activated to replace defective ones without interfering with the interconnect patterns.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces a second substrate as an intermediary layer containing repair LEDs. This intermediary substrate acts as a mediator between the defective LED and the replacement solution, allowing repair without direct contact or damage to the original substrate's interconnect patterns.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If the defective micro LED is removed by heating with a laser, then the defective LED can be eliminated, but delicate work and many steps are required resulting in great increase in cost

Engineering Contradiction:
Improvedefective LED eliminationVSAvoidrepair cost and labor
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The patent performs preliminary action by pre-positioning repair LEDs on a second substrate that can be stacked over the first substrate. This preliminary preparation eliminates the need for costly and labor-intensive laser heating and delicate removal operations during actual repair, as the repair LEDs are already in place and can be selectively activated.

Inventive Principle:
Principle #10Preliminary action

3Ease of repair

If a second transparent substrate with repair LED is stacked on the first substrate, then the repair process is simplified and costs are reduced, but the device structure becomes more complex

Engineering Contradiction:
Improverepair process simplicityVSAvoidsubstrate stacking structure
Core Design Contradiction:
Ease of repairVSDevice complexity

Solution Approach 1:

The patent resolves the structural complexity issue by transitioning to another dimension - stacking the second substrate vertically over the first substrate rather than modifying the original substrate plane. This dimensional approach allows the repair functionality to be added without interfering with the original interconnect patterns and simplifies the repair process by enabling selective activation of repair LEDs.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS20250087649A1Display device and repair method
Publication Date: 2025.03.13 ALPS ALPINE CO LTD
  • US20250087649A1 patent drawing
  • US20250087649A1 patent drawing
  • US20250087649A1 patent drawing

AI summary

A display device includes a first substrate including a plurality of light-emitting elements arranged two-dimensionally, and a second substrate stacked on the first substrate. At least the second substrate is transparent. The second substrate includes a repair light-emitting element arranged on the second substrate at a position thereon that corresponds to a defective light-emitting element on the first substrate.