Micro LED Display Module Manufacturing with Pre-Hardening Defect Detection
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Solution Overview
Problem
The challenge in manufacturing micro LED display modules lies in efficiently identifying and replacing defective micro LEDs to ensure high brightness and excellent color tones, as existing methods lack effective processes for real-time detection and replacement during the adhesive layer hardening process.
Innovation Solution
A method involving pressurizing micro LEDs to electrically connect them to a substrate, driving them to check operation states, and hardening the adhesive layer based on these states, with the option to replace defective LEDs using a pick-and-place method, ensuring stable electrical connection and efficient manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the adhesive layer is hardened immediately after bonding micro LEDs to the substrate, then the manufacturing process is simplified and productivity is improved, but defective micro LEDs cannot be detected or replaced, worsening product reliability
Solution Approach 1:
The patent applies preliminary action by performing detection and replacement operations before the adhesive layer is hardened. Specifically, the micro LEDs are detected for defects while the adhesive is still in its uncured state, allowing easy removal and replacement. This preliminary detection and repair phase occurs during the bonding process before final hardening, enabling defective units to be corrected without requiring adhesive removal or rework.
2Ease of manufacture
If defective micro LEDs are detected and replaced after the adhesive layer is hardened, then manufacturing simplicity is maintained, but the complexity of removing and re-bonding components increases and manufacturing time is lost
Solution Approach 1:
The patent performs the detection and replacement action preliminarily, during the bonding phase before hardening completes. This timing allows defective micro LEDs to be removed and replaced while the adhesive is still pliable, avoiding the need to cut through hardened adhesive or perform complex re-bonding operations later.
Solution Approach 2:
The patent skips the time-consuming steps of adhesive removal and re-bonding by performing all necessary detection and replacement operations while the adhesive is still in its working state. This rushes through the critical repair window before hardening locks the assembly, eliminating subsequent disassembly and reassembly steps.
3Ease of manufacture
If all micro LEDs are bonded to the substrate before detection, then the bonding process is simplified, but the ability to replace defective LEDs without disrupting bonded units is reduced
Solution Approach 1:
The patent performs detection and repair as preliminary actions during the bonding process itself, before the adhesive hardens. This creates a temporary window where all micro LEDs are bonded but can still be easily manipulated and replaced if defective, combining the simplicity of full bonding with the ease of repair.
Data Source
AI summary
A method of manufacturing a micro light emitting diode (LED) display module. The method of manufacturing a micro LED display module may include: pressing a plurality of micro LEDs disposed on a substrate to which an adhesive layer is applied, to electrically connect the plurality of micro LEDs to electrode pads of the substrate; performing testing to detect whether at least one of the plurality of micro LEDs is defective in a state in which the plurality of micro LEDs are pressurized and the adhesive layer is uncured; and based on detecting that at least one of the plurality of micro LEDs is defective, performing control to harden the adhesive layer.