Micro LED Display Bonding for Faster, Defect-Resistant Manufacturing
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Solution Overview
Problem
The existing methods for manufacturing micro LED display devices face challenges such as lengthy transfer processes and high risks of connection defects between micro LEDs and drive circuits, leading to reduced yield and increased costs, especially with higher image resolutions like 4K and 8K.
Innovation Solution
A manufacturing method that involves bonding a semiconductor layer with micro LEDs to a circuit board, forming light-emitting elements directly on the board, and using reflective wiring layers to enhance luminous efficiency, thereby shortening the transfer process and improving yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If many micro LEDs are individually formed and sequentially transferred to a substrate, then high image quality such as full HD, 4K, 8K can be achieved, but an enormous amount of time is necessary for the transfer process and connection defects may occur
Solution Approach 1:
The patent merges multiple micro LEDs and their corresponding drive circuits into a single integrated substrate structure. The semiconductor layer contains multiple light-emitting elements formed on one substrate, which are then bonded to a circuit board as a unit, eliminating the need for sequential individual transfer of each micro LED and significantly reducing transfer time.
Solution Approach 2:
The patent performs preliminary formation of multiple micro LEDs and their drive circuits on a semiconductor substrate before bonding to the final circuit board. This preliminary integration allows all light-emitting elements to be pre-assembled with their corresponding drive circuits, avoiding time-consuming sequential transfers and reducing connection defect risks.
2Manufacturing precision
If many micro LEDs are individually formed and sequentially transferred to a substrate, then high image quality such as full HD, 4K, 8K can be achieved, but connection defects between micro LEDs and drive circuits may occur
Solution Approach 1:
The patent merges multiple micro LEDs and their corresponding drive circuits into a single integrated substrate structure. The semiconductor layer contains multiple light-emitting elements formed on one substrate, which are then bonded to a circuit board as a unit, eliminating the need for sequential individual transfer of each micro LED and significantly reducing transfer time.
Solution Approach 2:
The patent performs preliminary formation of multiple micro LEDs and their drive circuits on a semiconductor substrate before bonding to the final circuit board. This preliminary integration allows all light-emitting elements to be pre-assembled with their corresponding drive circuits, avoiding time-consuming sequential transfers and reducing connection defect risks.
3Manufacturing precision
If individually-formed micro LEDs are sequentially transferred to a drive circuit substrate, then high image quality can be achieved, but the transfer process becomes extremely complex and time-consuming
Solution Approach 1:
The patent merges multiple micro LEDs and their corresponding drive circuits into a single integrated substrate structure. The semiconductor layer contains multiple light-emitting elements formed on one substrate, which are then bonded to a circuit board as a unit, eliminating the need for sequential individual transfer of each micro LED and significantly reducing transfer time.
Solution Approach 2:
The patent performs preliminary formation of multiple micro LEDs and their drive circuits on a semiconductor substrate before bonding to the final circuit board. This preliminary integration allows all light-emitting elements to be pre-assembled with their corresponding drive circuits, avoiding time-consuming sequential transfers and reducing connection defect risks.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly reduces the transfer time of micro LEDs and minimizes connection defects, enabling the production of high-definition displays with increased luminous efficiency and improved yield.
Implementation Method 1
The wiring layer includes a part that is light-reflective. The light-emitting element is located on the part.
Data Source
AI summary
An image display device includes: a light-transmitting substrate including a first surface; a circuit element located on the first surface; a first wiring layer electrically connectable to the circuit element; a first insulating film covering the circuit element and the first wiring layer on the first surface; a light-emitting element located on the first insulating film; a second insulating film covering at least a portion of the light-emitting element; a second wiring layer located on the second insulating film, the second wiring layer being electrically connected to a surface of the light-emitting element including a light-emitting surface opposite to a surface of the light-emitting element at a first insulating film side; and a first via extending through the first and second insulating films, the first via electrically connecting the first wiring layer and the second wiring layer.