Micro LED Display Module Batch Transfer via Common Electrode

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Solution Overview

Problem

The challenge in manufacturing micro LED display modules lies in the difficulty of transferring and bonding micro LEDs of different colors, leading to low product yield and high production costs due to their small size and complex handling requirements.

Innovation Solution

A micro LED display module is produced with micro LEDs arranged in an array on a driver chip block, where each pixel is driven by pixel electrodes and a light transmissive conductive layer acts as a common electrode, allowing for easier handling and assembly, and a RGB color layer is added for full-color display capabilities.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If micro LEDs of different colors are manufactured and attached in separate batches, then color accuracy and display quality are improved, but transfer difficulty and production complexity increase significantly

Engineering Contradiction:
Improvecolor accuracyVSAvoidproduction complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent segments the micro LED array into modular units that can be manufactured together on a single substrate and then transferred as integrated blocks. This maintains color accuracy by keeping different colored micro LEDs in fixed spatial relationships while reducing transfer complexity by handling larger integrated units rather than individual micro LEDs.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The patent performs preliminary actions by pre-attaching micro LEDs of different colors to a temporary substrate in their final spatial arrangement before the actual transfer process. This preliminary positioning ensures color accuracy is maintained while simplifying the subsequent transfer operation, as the entire pre-assembled array is transferred in one operation rather than assembling individual LEDs at the final location.

Inventive Principle:
Principle #10Preliminary action

2Manufacturing precision

If individual micro LEDs are transferred and bonded separately, then positioning precision is improved, but production efficiency and yield deteriorate

Engineering Contradiction:
Improvepositioning precisionVSAvoidproduction efficiency
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent merges multiple individual micro LED transfer operations into a single batch transfer operation. By keeping micro LEDs of different colors attached to a common substrate during transfer, the system achieves positioning precision through the substrate's alignment features while dramatically improving production efficiency by transferring many LEDs simultaneously rather than one at a time.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent introduces a temporary substrate as an intermediary carrier that holds multiple micro LEDs in their correct spatial relationships during the transfer process. This intermediary enables batch transfer with high positioning precision by providing alignment references, while improving productivity by allowing simultaneous transfer of multiple LEDs that would otherwise require separate operations.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Manufacturing precision

If micro LEDs are miniaturized to achieve high resolution, then display resolution is improved, but handling difficulty and transfer complexity increase

Engineering Contradiction:
Improvedisplay resolutionVSAvoidhandling ease
Core Design Contradiction:
Manufacturing precisionVSEase of operation

Solution Approach 1:

The patent applies a nested structure where individual miniaturized micro LEDs are nested within a larger temporary substrate array, which is then nested within the final display module during transfer. This nested approach maintains the high resolution benefits of miniaturized LEDs while making handling easier by providing progressively larger manipulation levels - the substrate array serves as a handle for transferring many tiny LEDs together.

Inventive Principle:
Principle #7Nested doll (Nesting)

Solution Approach 2:

The patent transitions from handling micro LEDs in one dimension (individual transfer) to handling them in two dimensions (array transfer on substrate). By maintaining the two-dimensional spatial arrangement of micro LEDs on the temporary substrate during transfer, the system achieves high resolution positioning while improving handling ease through the substrate's larger physical dimensions that are easier to manipulate.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

4Manufacturing precision

If complex batch transfer processes are used for micro LEDs, then color accuracy is maintained, but production cost and time increase

Engineering Contradiction:
Improvecolor accuracyVSAvoidproduction time
Core Design Contradiction:
Manufacturing precisionVSLoss of time

Solution Approach 1:

The patent ensures continuity of useful action by maintaining the spatial relationships and relative positions of micro LEDs of different colors throughout the entire transfer process. The temporary substrate allows the transfer operation to proceed continuously as a batch process rather than requiring intermittent stopping and repositioning, thereby maintaining color accuracy while reducing total production time compared to sequential individual transfer methods.

Inventive Principle:
Principle #20Continuity of useful action

Data Source

PatentUS10403614B2Micro LED display module
Publication Date: 2019.09.03 SYNDIANT INC
  • US10403614B2 patent drawing
  • US10403614B2 patent drawing
  • US10403614B2 patent drawing

AI summary

A micro LED display module and a manufacturing method thereof are provided. The micro LED display module comprises a driver chip block, a LED block, a circuit board and a color layer. The driver chip block has a plurality of pixel electrodes. The LED block is disposed in the driver chip block and has two semiconductor layers and a plurality of trenches. One of the two semiconductor layers is electrically connected to the pixel electrodes and the other is electrically connected to the light transmissive conductive layer. The trenches define a plurality of micro LED pixels arranged in an array. Each trench at least penetrates through the light emitting layer and one of the semiconductor layers. Each micro LED pixel corresponds to one of the pixel electrodes. The circuit board is electrically connected to the driver chip block, the color layer is disposed in the light transmissive conductive layer, and one of the semiconductor layers has a common electrode.