Micro LED Display Redundancy for Power and Quality
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Solution Overview
Problem
Active matrix organic light emitting diode (AMOLED) display panels consume significant power, limiting battery life in battery-operated devices, and existing technologies have not effectively addressed this issue to reduce power consumption while maintaining image quality.
Innovation Solution
The integration of micro light emitting diode (LED) devices with a redundancy scheme, where micro LED devices are bonded to the display substrate, and a method for detecting and repairing irregularities such as missing or defective micro LED devices, allowing for efficient power use and uniform emission across the display panel.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If AMOLED display panels are used to provide high-resolution color display, then image quality is improved, but power consumption increases significantly
Solution Approach 1:
The patent changes the fundamental operating parameters of the display by replacing organic light-emitting materials with micro LED devices. This parameter change enables the display to achieve high brightness and color quality (improving image quality) while consuming significantly less power compared to traditional AMOLED technology, directly resolving the technical contradiction between image quality and power consumption
2Use of energy by moving object
If micro LED devices are integrated into the display substrate, then power consumption is reduced, but manufacturing complexity increases due to bonding and inspection processes
Solution Approach 1:
The patent implements preliminary action by performing comprehensive inspection of micro LED devices before they are bonded to the display substrate. Defective devices are identified and removed in advance, preventing manufacturing defects from propagating through subsequent processes. This preliminary inspection and pre-processing approach simplifies the overall manufacturing complexity by catching issues early rather than requiring complex rework processes later
3Use of energy by moving object
If micro LED devices are bonded to the display substrate, then power consumption is reduced, but manufacturing precision requirements increase for bonding alignment
Solution Approach 1:
The patent introduces an intermediary approach by using a systematic alignment methodology that incorporates reference markers and controlled bonding processes. This intermediary alignment system acts as a mediator between the micro LED devices and the display substrate, ensuring precise positioning without requiring extreme manufacturing precision. The alignment process serves as an intermediate step that facilitates accurate bonding while managing the complexity of precision requirements
4Reliability
If redundancy scheme is implemented to detect and repair defective micro LED devices, then reliability is improved, but device complexity increases
Solution Approach 1:
The patent applies preliminary action by implementing inspection processes that detect defective micro LED devices before final assembly. By identifying and removing defective devices in advance, the redundancy scheme prevents failures rather than relying solely on complex repair mechanisms. This preliminary detection approach improves reliability while managing complexity by catching defects early in the manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces power consumption, achieving efficient light emission with micro LED devices while ensuring uniform brightness and extending battery life without altering the underlying TFT architecture.
Implementation Method 1
micro light emitting diode (LED) devices are bonded to a corresponding array of bottom electrodes within a corresponding array of subpixels
Data Source
AI summary
A display panel and method of manufacture are described. In an embodiment, a display substrate includes a pixel area and a non-pixel area. An array of subpixels and corresponding array of bottom electrodes are in the pixel area. An array of micro LED devices are bonded to the array of bottom electrodes. One or more top electrode layers are formed in electrical contact with the array of micro LED devices. In one embodiment a redundant pair of micro LED devices are bonded to the array of bottom electrodes. In one embodiment, the array of micro LED devices are imaged to detect irregularities.