Micro LED Dual Protection Layer Design
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Solution Overview
Problem
Micro Light-Emitting Diode (LED) devices require enhanced protection mechanisms to address the challenges of miniaturization, reliability, and durability, especially in micro-LED displays where existing technologies fall short in providing adequate safeguarding against mechanical stress and environmental factors.
Innovation Solution
A micro light-emitting diode device is designed with a dual protection layer system, where a first protection layer is placed on one portion of the outer side wall and a second protection layer is positioned between the first layer and the substrate, offering a buffering effect for connected circuits and enhancing the device's structural integrity through varying thicknesses, materials, and angles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single protection layer is used on the micro LED, then the structure is simple, but the protection effect against mechanical stress and environmental factors is insufficient
Solution Approach 1:
The protection structure is divided into multiple independent protection layers (first protection layer, second protection layer, third protection layer) with different functions and positions. Each layer provides specific protection against different types of damage, achieving comprehensive protection through segmentation rather than relying on a single complex layer.
Solution Approach 2:
The protection structure extends from a single planar layer to a three-dimensional multi-layer configuration with varying thicknesses and positions. The layers are arranged at different heights and distances from the micro LED, creating a spatial distribution that enhances protection while managing complexity through dimensional organization.
2Reliability
If the protection layer is made thicker to improve protection, then the protection effect is enhanced, but the space for circuit distribution is reduced
Solution Approach 1:
The thick protection structure is segmented into multiple layers with different thicknesses. The first protection layer has greater thickness for maximum protection, while the second and third layers have reduced thicknesses. This segmentation allows the circuit to be distributed in the space between layers, maintaining both protection and circuit space.
Solution Approach 2:
The protection structure utilizes vertical dimension with layers at different heights (first layer at highest position, second layer at intermediate position, third layer at lowest position). This vertical arrangement creates horizontal spaces between layers for circuit distribution, effectively separating the protection function from the circuit space requirement.
3Reliability
If the first protection layer extends close to the substrate, then the protection coverage is maximized, but the gap for circuit routing is reduced
Solution Approach 1:
The protection structure is segmented into multiple layers with the first protection layer providing maximum coverage by extending close to the substrate, while the second and third protection layers are positioned at different distances. This segmentation allows circuit routing in the gaps between layers without compromising the overall protection coverage.
Solution Approach 2:
The solution moves from a two-dimensional planar protection layer to a three-dimensional multi-layer structure. The first protection layer maximizes horizontal coverage, while vertical spacing between layers creates routing channels for circuits, separating the coverage function from the routing space requirement.
4Ease of manufacture
If uniform thickness is used for all protection layers, then the manufacturing process is simplified, but the buffering effect for circuits is reduced
Solution Approach 1:
Different protection layers are designed with different thicknesses according to their specific functional requirements. The first protection layer has greater thickness for primary protection, while the second and third layers have progressively reduced thicknesses. This local differentiation optimizes the buffering effect for circuits while maintaining manufacturability through a systematic thickness gradient.
Solution Approach 2:
The thickness parameter of the protection layers is systematically varied across different layers. The first protection layer has a first thickness, the second protection layer has a second thickness smaller than the first, and the third protection layer has a third thickness smaller than the second. This parameter change creates a gradient structure that provides buffering effect while remaining manufacturable.
Data Source
AI summary
A micro light-emitting diode device includes a substrate, a micro light-emitting diode, a first protection layer and a second protection layer. The micro light-emitting diode is adapted to be disposed on the substrate. The first protection layer is disposed on a first portion of an outer side wall of the micro light-emitting diode and has a gap from the substrate. The second protection layer is disposed on a second portion of the outer side wall of the micro light-emitting diode. The second protection layer is located in the gap between the first protection layer and the substrate and covers a part of the first protection layer. A maximum thickness of the first protection layer on the outer side wall is less than a maximum thickness of the second protection layer on the outer side wall.