Micro-LED Chip Structure for Edge Recombination Isolation

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Solution Overview

Problem

Existing micro-LED structures face challenges in enhancing light emission efficiency due to surface recombination carrier loss at the edges of the light emitting layer contacting the conductive layers.

Innovation Solution

A micro-LED structure is designed with a light emitting layer that extends horizontally away from the edges of the first and second conductive layers, preventing edge contact and reducing surface recombination, while also incorporating a metal layer on the light emitting layer between adjacent micro-LEDs for improved isolation and efficiency.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If the light emitting layer contacts the edges of the conductive layers, then the device structure is simpler and easier to manufacture, but surface recombination carrier loss increases and light emission efficiency decreases

Engineering Contradiction:
Improveease of manufactureVSAvoidsurface recombination carrier loss
Core Design Contradiction:
Ease of manufactureVSLoss of energy

Solution Approach 1:

An isolation layer is introduced as an intermediary component between the light emitting layer and the conductive layers. This isolation layer prevents direct contact at the edges, thereby reducing surface recombination carrier loss while maintaining structural integrity and manufacturability. The isolation layer acts as a mediator that resolves the conflict between ease of manufacture and energy loss.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Loss of energy

If the light emitting layer extends horizontally away from the conductive layer edges, then light emission efficiency is improved by reducing surface recombination, but device structure becomes more complex

Engineering Contradiction:
Improvelight emission efficiencyVSAvoiddevice structure
Core Design Contradiction:
Loss of energyVSDevice complexity

Solution Approach 1:

The isolation layer serves as a simple intermediary structure that achieves the beneficial effect of horizontal extension without the full complexity. By placing the isolation layer at the interface between the light emitting layer and conductive layers, the patent achieves reduced surface recombination while maintaining a relatively simple overall device structure.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Productivity

If adjacent micro-LEDs are placed close together for higher density, then productivity is improved, but carrier injection efficiency decreases due to interference between adjacent devices

Engineering Contradiction:
Improvemicro-LED densityVSAvoidcarrier injection efficiency
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The isolation layer segments the active regions of adjacent micro-LEDs, creating electrical and optical isolation between them. This segmentation allows micro-LEDs to be placed closer together for higher density while preventing interference between adjacent devices, thereby maintaining carrier injection efficiency despite increased productivity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The isolation layer acts as an intermediary barrier between adjacent micro-LEDs, preventing harmful interactions while allowing close spacing. This intermediary structure enables higher device density without sacrificing the reliability of carrier injection in each individual micro-LED.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances light emission efficiency by minimizing surface recombination and improving carrier injection efficiency, while the metal layer aids in isolating adjacent micro-LEDs, leading to improved performance and reliability.

Implementation Method 1

A micro-light emitting diode (micro-LED) is a device that emits light using an electric signal

Methodology Applied
Scientific EffectElectroluminescence: Electroluminescence

Data Source

PatentUS12206043B2Micro-LED structure and micro-LED chip including same
Publication Date: 2025.01.21 JADE BIRD DISPLAY (SHANGHAI) LTD
  • US12206043B2 patent drawing
  • US12206043B2 patent drawing
  • US12206043B2 patent drawing

AI summary

A micro-LED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer is continuously formed on the whole micro-LED chip, the multiple micro-LEDs sharing the light emitting layer. The micro-LED chip further includes: a top spacer formed on a top surface of the light emitting layer; a bottom spacer formed on a bottom surface of the light emitting layer; and an isolation structure formed between adjacent micro-LEDs.