Micro-LED Chip Structure for Lower Edge Recombination Loss
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Solution Overview
Problem
Existing micro-LED structures face challenges in enhancing light emission efficiency due to surface recombination carrier loss at the edges of the light emitting layer contacting the conductive layers.
Innovation Solution
A micro-LED structure is designed with a light emitting layer that extends horizontally away from the edges of the first and second conductive layers, preventing edge contact and reducing surface recombination, while also incorporating a metal layer on the light emitting layer between adjacent micro-LEDs for improved isolation and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the light emitting layer contacts the edges of the conductive layers, then the device structure is simplified, but surface recombination carrier loss increases and light emission efficiency decreases
Solution Approach 1:
The patent extracts the light emitting layer from direct contact with the conductive layer edges by creating a horizontal extension configuration. The light emitting layer extends beyond the vertical projection of the conductive layer edges, effectively separating the light emission region from the high-recombination edge regions of the conductive layers.
Solution Approach 2:
The patent introduces a horizontal dimension extension to the light emitting layer configuration. Instead of merely vertical stacking, the light emitting layer extends horizontally away from the conductive layer edges, creating a three-dimensional configuration that reduces edge contact and associated surface recombination losses.
2Loss of energy
If the light emitting layer extends horizontally away from conductive layer edges, then light emission efficiency improves, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies local quality by creating a specific horizontal extension configuration only at the edges where the light emitting layer contacts the conductive layers. This localized structural modification targets the specific problem areas (edge contact regions) without requiring precision control throughout the entire device structure.
3Productivity
If adjacent micro-LEDs are placed close together, then device integration density increases, but carrier leakage between adjacent devices increases
Solution Approach 1:
The patent introduces an intermediary metal layer configuration between adjacent micro-LEDs. This metal layer serves as a mediator that provides both electrical connection and isolation functions, preventing carrier leakage between adjacent devices while allowing close spacing for high integration density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances light emission efficiency by minimizing surface recombination and improving carrier injection efficiency, while the metal layer aids in isolating adjacent micro-LEDs, leading to improved performance and reliability.
Implementation Method 1
a micro-light emitting diode (micro-LED) is a device that emits light using an electric signal
Data Source
AI summary
A micro-LED chip includes multiple micro-LEDs. At least one micro-LED of the multiple micro-LEDs includes: a first type conductive layer; a second type conductive layer stacked on the first type conductive layer; and a light emitting layer formed between the first type conductive layer and the second type conductive layer. The light emitting layer is continuously formed on the whole micro-LED chip, the multiple micro-LEDs sharing the light emitting layer. A bottom edge of the second type conductive layer is aligned with a top edge of the first type conductive layer.