Micro LED Display Panel Side Wiring Layout for Uniform Edge Connections
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Solution Overview
Problem
In bezelless display panels, the thickness of side wirings connecting the TFT substrate and the driver IC is not uniform due to the edged portion of the edge, affecting the stability of the connection.
Innovation Solution
The display panel features connection wirings on the side surface of the TFT substrate with cutting areas formed inwardly, which can be inclined, curved, or multi-stage, to ensure uniform thickness and stability, with first and second connection pads disposed at intervals for stable electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If side wirings are formed along the edge of the TFT substrate to achieve bezelless design, then the active display area is maximized, but the thickness of the side wirings becomes non-uniform due to the edged portion
Solution Approach 1:
The edge area of the TFT substrate is segmented into a cutting area and a non-cutting area. The cutting area is removed to create a recessed structure that accommodates the side wirings, separating the wiring formation zone from the active display area. This segmentation allows uniform wiring thickness while maintaining bezelless design.
Solution Approach 2:
The solution transitions from a two-dimensional planar edge structure to a three-dimensional recessed structure by removing the cutting area. This dimensional change creates vertical space that enables uniform wiring thickness along the edge while maximizing the horizontal active display area.
2Manufacturing precision
If the edged portion of the edge is removed to improve wiring uniformity, then the thickness uniformity of side wirings is improved, but the structural stability of the substrate edge may be compromised
Solution Approach 1:
The cutting area is selectively applied only to the regions where side wirings need to be formed, while other edge areas maintain their original structure. This localized modification improves wiring uniformity without compromising the overall structural stability of the substrate edge.
Solution Approach 2:
The cutting area is removed in advance during the substrate fabrication process, before the side wirings are formed. This preliminary action creates the necessary recessed structure that ensures uniform wiring thickness from the beginning, preventing subsequent stability issues.
3Device complexity
If connection wirings are disposed on the side surface of the TFT substrate, then the bonding area of the driver IC can be moved to the back side, but the stability of the connection wirings is affected by the non-uniform thickness
Solution Approach 1:
The substrate edge is segmented into a cutting area and a non-cutting area, creating a recessed structure that specifically accommodates the connection wirings. This segmentation ensures uniform wiring thickness and improves reliability while allowing the bonding area to be reconfigured on the back side.
Solution Approach 2:
The cutting area acts as an intermediary structure that mediates between the TFT substrate and the driver IC bonding area. By providing a recessed, uniform-thickness region, it ensures stable connection wiring formation while enabling the back-side bonding configuration.
Data Source
AI summary
A display panel is disclosed. The disclosed display panel includes a thin film transistor substrate, a plurality of micro LEDs arranged on one surface of the thin film transistor substrate, a plurality of first connection pads disposed on the one surface of the thin film transistor substrate, a plurality of second connection pads disposed on the other surface of the thin film transistor substrate that faces the one surface, and a plurality of connection wirings disposed on a side surface of the thin film transistor substrate for electrically connecting each of the plurality of first connection pads and the plurality of second connection pads, wherein at least one of an edge region on the one surface and an edge region on the other surface of the thin film transistor substrate includes a cutting area which is cut in an inward direction of the thin film transistor substrate.