Micro-LED Mass Transfer Using Electro-Curable Adhesive Alignment

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Solution Overview

Problem

The current mass transfer methods for micro-LEDs suffer from low alignment accuracy, leading to position deviations during the transfer process, which affects contact areas and resistances between micro-LEDs and gate/data lines, and increases the size of pins and line widths, hindering the realization of high-resolution display panels.

Innovation Solution

A mass transfer method utilizing electro-curable adhesives, where a transfer device aligns with a base substrate by applying voltage differences to cure the adhesive, ensuring precise positioning of micro-LEDs on the substrate, thereby improving alignment accuracy.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional mass transfer methods are used for micro-LEDs, then the transfer process is simple, but the alignment accuracy is low leading to position deviations

Engineering Contradiction:
Improvealignment accuracyVSAvoidtransfer process complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent introduces an electro-curable adhesive as an intermediary substance between the micro-LED and the base substrate. This adhesive layer enables precise positioning by being cured through voltage application, creating a stable bond that maintains alignment accuracy while facilitating the transfer process

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent replaces conventional mechanical alignment and bonding methods with an electro-curable adhesive system. Instead of relying on mechanical precision and physical bonding, the system uses electrical voltage to cure the adhesive, achieving superior alignment accuracy without increasing mechanical system complexity

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Manufacturing precision

If alignment accuracy is improved through electro-curable adhesive, then position deviations are reduced, but the process requires voltage application and curing

Engineering Contradiction:
Improvepositioning precisionVSAvoidmanufacturing simplicity
Core Design Contradiction:
Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The patent changes the physical-chemical state of the adhesive from liquid to solid through voltage-induced curing. This parameter change allows the adhesive to transition from a state that enables alignment adjustment to a state that provides stable, precise positioning, thereby improving positioning precision while adding a controllable manufacturing step

Inventive Principle:
Principle #35Parameter changes

3Manufacturing precision

If position deviations are reduced for high-resolution displays, then pin sizes and line widths can be reduced, but the transfer process becomes more complex

Engineering Contradiction:
Improvealignment accuracyVSAvoidtransfer efficiency
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent applies voltage to cure the electro-curable adhesive during the alignment phase, before the actual transfer is completed. This preliminary action secures the alignment accuracy early in the process, allowing subsequent transfer steps to proceed efficiently without compromising positioning precision

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method enhances alignment accuracy between micro-LEDs and the base substrate, reducing position deviations and allowing for higher resolution displays by ensuring accurate contact and reduced pin sizes, thus improving the overall performance of micro-LED display panels.

Implementation Method 1

providing a base substrate, wherein the base substrate comprises a plurality of areas in an array, each of the plurality of areas comprising a second electrode and an electro-curable adhesive on the second electrode; aligning the transfer device with the base substrate, such that a portion of each first electrode extending to the side edge of the light-emitting unit is in contact with a respective electro-curable adhesive

Methodology Applied
Scientific EffectElectro-curable adhesive curing: Photopolymerisation

Data Source

PatentUS11322485B2Mass transfer method for light-emitting unit, array substrate, and display device with electro-curable adhesive
Publication Date: 2022.05.03 BOE TECHNOLOGY GROUP CO LTD
  • US11322485B2 patent drawing
  • US11322485B2 patent drawing
  • US11322485B2 patent drawing

AI summary

The present disclosure relates to the field of display, specifically, to a mass transfer method for a light-emitting unit, an array substrate, and a display device. The method comprises: providing a plurality of light-emitting units in an array, wherein each light-emitting unit comprises a first electrode extending to a side edge of the light-emitting unit; providing a base substrate comprising a plurality of areas in an array, each area comprising a second electrode and an electro-curable adhesive thereon; picking up the light-emitting units by a transfer device; applying voltages to the first and second electrodes respectively; aligning the transfer device with the base substrate, such that a portion of each first electrode extending to the side edge of the light-emitting unit contacts a respective electro-curable adhesive; and separating the transfer device from the light-emitting units, such that each light-emitting unit is transferred to a respective area of the base substrate.