Micro-LED Array Formation via Electromagnetic Liquid Suspension
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Solution Overview
Problem
The challenge lies in accurately and efficiently arranging a large number of micro-LED chips into a micro-LED array for high-resolution display devices, as existing methods are time-consuming and labor-intensive, especially when dealing with millions of chips.
Innovation Solution
A method and system involving micro-component devices floating on a liquid suspending medium, where electromagnetic forces are used to adjust their proximity and transfer them onto a carrier substrate, utilizing a conductive wire assembly to control target gaps and densities, allowing for simultaneous and precise array formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional manual or sequential methods are used to arrange micro-LED chips, then each chip can be placed with some precision, but the process becomes extremely time-consuming and labor-intensive when dealing with millions of chips
Solution Approach 1:
The patent merges multiple micro-LED chips onto a single carrier substrate simultaneously through a unified arrangement process. The conductive wire assembly engages multiple chips at once, and the liquid suspending medium enables collective manipulation, transforming a sequential operation into a parallel mass arrangement process that dramatically increases productivity while maintaining precision
Solution Approach 2:
The patent replaces traditional mechanical pick-and-place systems with an electromagnetic-based arrangement method. The conductive wire assembly uses electromagnetic forces to manipulate micro-LED chips in the liquid suspending medium, eliminating the need for complex mechanical grippers and placement mechanisms, thereby enabling faster and more efficient mass arrangement
2Manufacturing precision
If more micro-LED chips are arranged to achieve higher resolution, then display quality improves, but the complexity and time required for the fabrication process increases significantly
Solution Approach 1:
The patent segments the fabrication process into distinct phases: first arranging multiple chips simultaneously on a carrier substrate using the conductive wire assembly and liquid suspending medium, then transferring the entire array as a unit. This segmentation allows high-density arrays to be created without proportionally increasing overall process complexity, as the most challenging arrangement step is performed in parallel rather than sequentially
Solution Approach 2:
The patent introduces a carrier substrate as an intermediary between the micro-LED chips and the final display device. The conductive wire assembly and liquid suspending medium serve as temporary mediators during the arrangement process, enabling precise positioning of millions of chips without requiring direct manual intervention or complex automated systems for the final device assembly
3Ease of operation
If conventional transfer methods are used after arranging micro-LED chips, then the chips can be moved to the display device, but additional mass transfer processes are required which increase fabrication time
Solution Approach 1:
The patent performs preliminary arrangement of multiple micro-LED chips onto a carrier substrate simultaneously before the final transfer to the display device. By pre-organizing the chips in their final configuration on the carrier substrate using the conductive wire assembly and liquid suspending medium, the subsequent transfer becomes a single mass transfer operation rather than multiple individual or small-batch transfers, significantly reducing total fabrication time
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables rapid, precise, and efficient formation of micro-component arrays with controlled target gaps, reducing the complexity and time required for micro-LED display fabrication by omitting additional mass transfer processes.
Implementation Method 1
actuating the micro-component devices floating on the surface of the liquid suspending medium to move into closer proximity by using electromagnetic forces
Data Source
AI summary
A method for mass arrangement of micro-component devices includes the following process stages: disposing the micro-component devices to float on a liquid suspending medium, wherein the micro-component devices are spaced apart from each other with a larger initial gap along a first direction and along a second direction; using electromagnetic force to actuate the floating micro-component devices to move closer so that the micro-component devices become spaced apart from each other with a smaller specified target gap along the first and the second directions; and transferring the arranged micro-component devices with the target gap on a carrier substrate. A system for arranging the micro-component devices is also disclosed to implement the method. Therefore, a precisely arranged array of the micro-component devices can be formed on a target application substrate.