Micro LED Substrate Assembly Using Electrowetting for Precise Placement
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Solution Overview
Problem
Current micro LED manufacturing methods face challenges in producing high-resolution large-area displays due to difficulties in assembly, reliability, precision, complexity, and increased costs associated with defects.
Innovation Solution
A method involving self-assembly of micro LEDs using electro-wetting and dielectrophoresis phenomena, where light emitting devices are dispersed in a fluid and guided to specific locations on a substrate using voltage signals, allowing for precise placement and migration across device areas.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If micro LEDs are attached to the panel one by one, then the display device can be manufactured, but the manufacturing process becomes very difficult and time-consuming
Solution Approach 1:
The patent segments the micro LED assembly process into two main stages: (1) batch assembly of micro LEDs onto a first substrate assembly in parallel, and (2) transfer of the entire assembled unit to the final panel. This segmentation enables simultaneous assembly of multiple micro LEDs rather than sequential attachment, dramatically improving manufacturing speed while reducing operational complexity.
Solution Approach 2:
The patent performs preliminary assembly of micro LEDs onto a first substrate assembly before final installation onto the panel. This preliminary action allows for pre-configuration and testing of the LED array, enabling batch processing and reducing the complexity of final panel assembly. The first substrate assembly serves as a temporary mounting platform that simplifies the overall manufacturing workflow.
2Manufacturing precision
If the resolution and area size of the display device increase, then the display quality improves, but the technical difficulty increases
Solution Approach 1:
The patent introduces an intermediate dimension by using a first substrate assembly as a temporary mounting platform. This additional dimensional layer allows for batch assembly and precise positioning of micro LEDs before final transfer to the panel. The first substrate assembly acts as a buffer that decouples the complexity of high-resolution assembly from the final panel installation, enabling precise positioning without proportionally increasing overall assembly difficulty.
3Quantity of substance
If a small number of light emitting devices are used, then the device count is reduced, but the assembly yield decreases
Solution Approach 1:
The patent performs preliminary assembly of micro LEDs onto the first substrate assembly with built-in test capabilities. This preliminary action allows for identification and replacement of defective devices before final panel assembly, thereby maintaining high assembly yield even when using smaller numbers of expensive micro LEDs. The test substrate enables quality control without compromising the final device count.
4Device complexity
If the assembly process is simplified, then the manufacturing complexity is reduced, but the precision of light emitting device placement may deteriorate
Solution Approach 1:
The patent segments the assembly process into distinct stages with specialized functions: batch assembly on first substrate, testing, and final transfer to panel. This segmentation allows each stage to be optimized independently - the first substrate assembly can focus on precise placement using simplified techniques, while the transfer process handles the complexity of final installation. The modular approach maintains precision without requiring the entire process to be complex.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the production of high-resolution large-area displays with improved assembly yield, reduced time, and cost-effectiveness by facilitating the use of fewer devices and allowing for reassembly in case of defects.
Implementation Method 1
applying a voltage signal to the first electrode, thereby inducing a electro-wetting phenomenon, so that the fluid flows
Implementation Method 2
applying a voltage signal in a second frequency range greater than the first frequency range to the first electrode, thereby inducing a dielectrophoresis phenomenon, so that at least one of the multiple light emitting devices is assembled onto the first electrode
Data Source
AI summary
The present invention is applicable to a display device-related technical field and relates to, for example, a substrate assembly of a display device using a micro light-emitting diode (LED) and to a method for manufacturing same. The present invention relates to a method for assembling individual light-emitting diodes on a plurality of individual device regions of a first substrate assembly in which the plurality of individual device regions are partitioned on a first substrate and first electrodes are positioned in the individual device regions, wherein the method may comprise the steps of: positioning a second substrate assembly including an insulation layer positioned on the first substrate assembly, second electrodes positioned on the insulation layer, and a second substrate positioned on the second electrodes; injecting a fluid in which a plurality of light-emitting diodes are dispersed between the first substrate assembly and the second substrate assembly; and flowing the plurality of light-emitting diodes; and assembling at least one of the plurality of light-emitting diodes on the first electrodes positioned in the individual device regions.