Micro LED Display Encapsulation Structure Against Moisture and Dust
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Solution Overview
Problem
Micro LED display devices are susceptible to damage from moisture and dust, which can compromise their properties and reduce their lifespan.
Innovation Solution
A micro LED display device design featuring a circuit substrate, pixel structure layer, support structure, connection layer, and protection layer, where the support structure protrudes from the pixel structure layer to form an accommodating space for the connection and protection layers, preventing moisture and dust intrusion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the micro LED display device is designed with a simple structure, then the manufacturing process is easier and device complexity is reduced, but the device becomes more susceptible to moisture and dust intrusion
Solution Approach 1:
The device is segmented into multiple functional layers including pixel structure layer, connection layer, support structure, and protection layer. Each layer serves a specific function and contributes to the overall protection system, allowing the complex protection function to be achieved through modular design
Solution Approach 2:
A protection layer is introduced as a thin film structure that provides waterproof and dustproof protection to the micro LED display device. This thin film approach maintains device thinness while providing effective environmental protection
2Reliability
If a protection layer is added to prevent moisture and dust intrusion, then the reliability and lifetime of the device are improved, but the device complexity and structural complexity increase
Solution Approach 1:
The support structure serves dual functions: providing mechanical support for the pixel structure layer and simultaneously forming an accommodating space with the pixel structure layer that houses the connection layer. This merging of functions reduces the need for separate protective components
Solution Approach 2:
The protection layer not only provides waterproof and dustproof protection but also serves as a structural component that completes the encapsulation of the device. The support structure provides both mechanical support and forms the accommodating space, demonstrating multi-functionality that reduces overall device complexity
3Ease of manufacture
If the micro LED units are exposed to the environment, then the device structure is simpler and easier to manufacture, but the light-emitting layers are damaged by moisture and dust
Solution Approach 1:
The pixel structure layer is formed with a predetermined configuration that includes features for receiving the support structure and forming the accommodating space. This preliminary structuring enables subsequent layers to be added in a systematic manner, maintaining manufacturing ease while achieving protection
Solution Approach 2:
The connection layer is disposed within the accommodating space formed by the pixel structure layer and support structure. The protection layer is then disposed on the connection layer, creating a nested structure where each layer is housed within the previous layer, providing protection while maintaining a compact and manufacturable design
Data Source
AI summary
A micro LED display device and manufacturing method thereof. The micro LED display device includes a circuit substrate, a pixel structure layer, a support structure, a connection layer and a protection layer. The pixel structure layer is disposed on the top surface of the circuit substrate, and has plural micro LED units disposed separately. The micro LED units face the top surface and are electrically connected with the circuit substrate. The support structure is disposed on the top surface, extending from the top surface to the pixel structure layer and connected with the side surface of the pixel structure layer. The support structure protrudes from a surface of the pixel structure layer away from the circuit substrate. The connection layer is disposed in the accommodating space formed by the support structure and the surface of the pixel structure layer. The protection layer is disposed on the connection layer.