Micro LED Module Flexible Circuit Cylindrical Vias
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Solution Overview
Problem
Conventional methods for forming microvia holes in multilayer flexible circuit boards result in truncated conical shapes, leading to interference and short-circuits in micro-LED modules, and existing displays on vehicles are prone to falling off, discoloration, and inability to display moving images effectively.
Innovation Solution
The use of cylindrical via holes with constant cross-sectional area and shape in multilayer flexible circuit boards for micro-LED modules, and a vehicle-mounted flexible display system with micro-LED panels attached to outer panels and pillars, allowing for secure attachment and high-quality image display.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional processes (CNC drilling, die punching, CO2 laser, or chemical etching) are used to form microvia holes, then the via holes can be formed with diameters of 50 to 100 micrometers, but the via holes have a truncated conical shape that causes interference and increases the possibility of short-circuits between adjacent electrodes
Solution Approach 1:
The patent changes the geometric parameters of the via holes from truncated conical to cylindrical shape with constant diameter (50-100 micrometers) throughout the multilayer circuit board thickness. This parameter change eliminates the wider surface sides that cause interference and reduce the interval between via holes, thereby preventing short-circuits between adjacent electrodes while maintaining manufacturing precision
Solution Approach 2:
Instead of accepting the conventional truncated conical shape as the default, the patent inverts the approach by forming via holes that maintain a constant cross-sectional area throughout their length. This inversion of the conventional geometry resolves the short-circuit issue by eliminating the problematic wider portions at the surface sides
2Productivity
If the interval between via holes is reduced to accommodate smaller electrode pads (80 micrometers or less), then more micro-LED chips can be mounted, but the truncated conical shape of via holes makes the interval narrower and increases short-circuit risk
Solution Approach 1:
By changing the via hole geometry to cylindrical shape with constant diameter, the patent enables narrower spacing between via holes without increasing short-circuit risk. This allows electrode pads of 80 micrometers or less to be positioned closer together, increasing micro-LED chip mounting density while maintaining reliability
Solution Approach 2:
The patent segments the via hole structure into multiple layers with consistent geometry, where each layer's via holes maintain the same cylindrical shape and spacing. This segmentation approach allows independent optimization of each layer's electrode pad layout while ensuring overall system reliability
3Adaptability or versatility
If conventional rigid displays are mounted on vehicle outer panels, then advertising and information can be displayed, but the displays are prone to falling off during long-term use or while driving
Solution Approach 1:
The patent employs a flexible display panel that can conform to the curved surface of vehicle outer panels. This flexible construction, combined with appropriate mounting structures, ensures the display remains securely attached during vehicle operation while maintaining adaptability for various display applications
Solution Approach 2:
The patent designs the display mounting system to accommodate the curved geometry of vehicle outer panels. By adapting the display structure to follow the panel's curvature rather than resisting it, the display achieves stable attachment that prevents falling off during long-term use or while driving
4Adaptability or versatility
If conventional displays are mounted on vehicle outer panels, then advertising can be displayed, but the displays may be partially or wholly discolored or faded over time
Solution Approach 1:
The patent incorporates protective measures that create a stable environment for the display, protecting it from UV radiation and atmospheric factors that cause discoloration and fading. This environmental protection extends the display's service life and maintains color stability over time
Solution Approach 2:
The patent employs LED technology with inherent durability and resistance to environmental degradation. The LED pixels and flexible circuit board are designed to withstand outdoor conditions, eliminating the discoloration and fading issues associated with conventional display technologies
5Adaptability or versatility
If conventional adhesive methods are used to post advertisements on vehicle outer panels, then advertising can be displayed, but the advertisements are not easy to frequently replace and cannot display moving pictures or images
Solution Approach 1:
The patent implements a dynamically controllable display system using LED pixels that can be individually controlled to display moving pictures, images, and text. The flexible construction allows the display to be easily replaced or reconfigured, providing both adaptability for various content and ease of replacement
Solution Approach 2:
The patent creates a universal display platform that can display various types of content (advertising, information, moving pictures, images) and can be applied to different vehicle outer panels. The modular LED pixel design allows the same display technology to serve multiple functions and be easily replaced or reconfigured
Data Source
AI summary
A micro-LED module is disclosed. The micro-LED module includes a flexible circuit board and a plurality of LED pixels mounted on the flexible circuit board. Each of the plurality of LED pixels includes a first micro-LED chip, a second micro-LED chip, and a third micro-LED chip. Each of the first micro-LED chip, the second micro-LED chip, and the third micro-LED chip has at least one side whose length is 100 μm or less. Each of the first micro-LED chip, the second micro-LED chip, and the third micro-LED chip includes one or more electrode pads having a width of 80 μm or less on the surface facing the flexible circuit board. The flexible circuit board includes a first flexible insulating film including electrode patterns formed on the upper surface thereof and connected to the electrode pads through solder bumps having a diameter of 80 μm or less and a second flexible insulating film connected to the bottom of the first flexible insulating film through a first conductive pattern. The first flexible insulating film includes a first via hole having the same cross-sectional shape and area from the upper to the lower end and a first via formed in the first via hole. The first via hole of the first flexible insulating film is connected to a portion of the first conductive pattern.