Micro-LED Electrode Layout for Flip-Tolerant Display Transfer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing micro-LED display devices face issues with accurate transfer to substrates due to their small size, leading to potential electrode misconnection and lighting defects during the transfer process.
Innovation Solution
A light emitting diode with a symmetrical structure featuring overlapping electrodes on opposite surfaces of a semiconductor layer, allowing stable connection with driving elements and power lines even when flipped during transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If micro-LED is transferred to substrate, then display device can be manufactured, but electrode misconnection and lighting defects occur due to flipping during transfer
Solution Approach 1:
The patent applies asymmetry by making the first and second electrodes asymmetric in design - the first electrode has a larger area than the second electrode. This asymmetric design allows the electrodes to be distinguished from each other, preventing misconnection during transfer processes where the micro-LED might be flipped, thereby resolving the reliability issue while maintaining manufacturing capability
2Measurement precision
If micro-LED size is reduced for high-definition display, then display quality improves, but transfer accuracy deteriorates
Solution Approach 1:
The patent introduces an additional distinguishing dimension by making the electrodes asymmetric in area. This dimensional difference provides a clear identifier that helps maintain transfer accuracy even when the micro-LED size is reduced for high-definition displays, allowing operators to verify correct orientation without compromising display quality
Data Source
AI summary
A light emitting diode includes a base layer, a first semiconductor layer surrounding a side surface of the base layer, a first electrode on a first surface of the first semiconductor layer, the first electrode electrically connected with the first semiconductor layer, and a second electrode on a second surface of the first semiconductor layer that is opposite to the first surface, the second electrode electrically connected with the first semiconductor layer, wherein the first electrode and the second electrode overlap each other.