Micro LED Package Fluid Assembly for Precise Display Placement
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Solution Overview
Problem
The existing methods for manufacturing micro LED displays face challenges in precisely placing a large number of micro LEDs on a display substrate, leading to increased complexity and cost as pixel density increases and display size decreases.
Innovation Solution
A method involving a first substrate with trenches and protruding portions, and a liquid suspension containing a light emitting element package that includes a second substrate, light emitting elements, an encapsulation layer, a pillar, and conductive pads. The light emitting element package is fluidly assembled into the substrate's trenches, ensuring precise alignment and connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If pick-and-place assembly is used to place micro LEDs one by one, then placement precision can be achieved, but manufacturing complexity and cost increase rapidly
Solution Approach 1:
The invention segments the manufacturing process into two main stages: (1) pre-assembly of light emitting element packages on a temporary substrate with conductive pads, and (2) transfer of pre-assembled packages to the display substrate. This segmentation allows complex operations to be performed once on batches rather than individually for each component, reducing overall manufacturing complexity while maintaining precision.
Solution Approach 2:
The invention performs preliminary assembly of light emitting element packages on a temporary substrate before final transfer to the display substrate. This preliminary action includes mounting light emitting elements, forming encapsulation layers, and establishing conductive connections in advance, so that when packages are transferred to the display substrate, only simple placement is required, thereby maintaining precision while reducing process complexity.
2Manufacturing precision
If pick-and-place assembly is used to place micro LEDs one by one, then placement precision can be achieved, but manufacturing cost increases rapidly
Solution Approach 1:
The invention merges multiple manufacturing operations into a single integrated process: light emitting element mounting, encapsulation layer formation, conductive pad connection, and package assembly are all performed together on the temporary substrate in one batch process. This merging eliminates the need for separate expensive pick-and-place operations for each component, significantly reducing manufacturing cost while maintaining precision through the batch processing approach.
Solution Approach 2:
By performing all complex assembly operations preliminarily on the temporary substrate before final transfer, the invention avoids the need for expensive real-time precision placement equipment during the final assembly step. The preliminary actions are performed once in batch mode using less expensive equipment, and the pre-assembled packages are then simply transferred to the display substrate, dramatically reducing manufacturing cost.
3Device complexity
If mass transfer method is used with auxiliary substrate as press mold, then manufacturing complexity is reduced, but placement precision deteriorates
Solution Approach 1:
The invention introduces a temporary substrate as an intermediary platform that provides precise alignment features (conductive pads and positioning structures) during the assembly process. This intermediary substrate acts as a precision fixture that maintains placement accuracy during package assembly, and then the completed packages are transferred from this precision intermediary to the final display substrate, preserving precision while simplifying the overall process.
Solution Approach 2:
The temporary substrate is prepared in advance with precise conductive pads and positioning structures that guide accurate placement of light emitting elements and packages. This preliminary preparation of the intermediary substrate establishes precision alignment features before any assembly occurs, ensuring that subsequent mass transfer operations maintain high precision without requiring complex real-time control systems.
4Manufacturing precision
If pixel density increases and display size decreases, then display quality improves, but manufacturing complexity and cost increase rapidly
Solution Approach 1:
The invention segments the display into modular light emitting element packages that are assembled in batches on a temporary substrate. This segmentation allows high-density pixel arrays to be manufactured by repeating the same batch assembly process multiple times rather than placing individual LEDs, making high pixel density achievable without proportionally increasing process complexity.
Solution Approach 2:
By performing preliminary assembly of complete light emitting element packages on the temporary substrate with pre-formed conductive pads and positioning structures, the invention prepares all necessary components for high-density placement in advance. This preliminary batch assembly ensures that when packages are transferred to the display substrate, even at high pixel densities, the process remains simple and manageable, avoiding exponential complexity increases.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables efficient and cost-effective manufacturing of micro LED displays by ensuring precise placement and connection of micro LEDs, reducing manufacturing time and increasing assembly speed, while maintaining high pixel density and display quality.
Implementation Method 1
a liquid suspension including a light emitting element package is made to flow through an upper surface of the first substrate... The light emitting element package is disposed in the trench
Data Source
AI summary
A light emitting element package includes a first substrate, at least one light emitting element, an encapsulation layer, and a plurality of conductive pads. The first substrate has an upper surface and a lower surface opposite to each other, in which an edge of the lower surface has a notch. The at least one light emitting element is disposed on the upper surface of the first substrate, in which the light emitting element has a positive electrode and a negative electrode. The encapsulation layer covers the light emitting element. The plurality of conductive pads are disposed on the lower surface of the first substrate and electrically connected to the positive electrode and the negative electrode of the light emitting element, respectively.