Micro-LED Package Pad Patterns for Precise Fluid Assembly
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Solution Overview
Problem
The challenge in micro-LED display manufacturing lies in precisely placing millions of micro-LEDs on a display substrate, which is time-consuming and costly due to increasing pixel density, especially for high-definition and 4K/8K TVs, where transfer times can take days and complexity rises significantly.
Innovation Solution
A micro-LED package design featuring a first substrate with micro-LED chips, a transparent protective layer, and conductive pads, where the conductive pads are arranged in concentric circle, concentric square, or nine-square grid patterns on the substrate, allowing for efficient fluid assembly by aligning flat edges, ensuring correct electrical connections and reducing manufacturing time and costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional stamping and placement methods are used for micro-LEDs, then manufacturing precision can be achieved, but productivity is extremely low and transfer time takes days for HDTVs
Solution Approach 1:
The invention divides the micro-LED array into multiple groups, with each group containing multiple micro-LEDs arranged in a specific pattern. This segmentation allows the entire group to be transferred simultaneously as one unit rather than placing individual micro-LEDs one by one, dramatically increasing productivity while maintaining precision through the group's structured arrangement
Solution Approach 2:
Multiple micro-LEDs are combined into a single transferable group structure that can be moved and placed together. The group includes micro-LEDs with their respective electrodes and insulating structures integrated, allowing simultaneous transfer of multiple elements that would otherwise require separate placement operations
2Manufacturing precision
If pixel density is increased for 4K and 8K TVs, then display quality is improved, but device complexity and manufacturing cost rise significantly
Solution Approach 1:
The high-density pixel array is segmented into multiple manageable groups, each with a defined pattern of micro-LEDs and insulating structures. This segmentation reduces the complexity of handling individual pixels while achieving high overall density through the systematic arrangement of groups across the display substrate
Solution Approach 2:
The micro-LEDs are pre-arranged in groups with their insulating structures and electrodes already in place before transfer. This preliminary organization of multiple micro-LEDs into structured groups simplifies the subsequent placement process, reducing the complexity that would otherwise arise from placing high-density pixels individually
3Reliability
If individual micro-LED placement is performed, then correct electrical connections can be established, but manufacturing time is excessively long
Solution Approach 1:
The electrical connection process is segmented into group-level operations rather than individual micro-LED operations. Each group maintains internal electrical connections between its micro-LEDs, and the group as a unit establishes connections to the display substrate, reducing the total number of connection operations required
Solution Approach 2:
Multiple electrical connection operations are merged into a single group transfer and placement operation. The group structure integrates multiple micro-LEDs with their electrodes and insulating structures, allowing simultaneous establishment of multiple electrical connections that would otherwise require separate operations
Data Source
AI summary
Provide a micro-light-emitting package includes a first substrate, a plurality of micro-light-emitting diodes (micro-LEDs), a transparent protective layer, and a plurality of conductive pads. The first substrate has an upper surface and a lower surface opposite to each other. The micro-LEDs are disposed on the upper surface of the first substrate. The micro-LEDs have a first electrode and a second electrode electrically opposite to the first electrode. The transparent protective layer covers the micro-LEDs. The plurality of conductive pads are disposed on the lower surface of the first substrate. The conductive pads include a first conductive pad, a second conductive pad, a third conductive pad, and a fourth conductive pad. The first conductive pad, the second conductive pad, the third conductive pad respectively electrically connected to the corresponding first electrode of the micro-LEDs. The fourth conductive pad is commonly electrically connected to the second electrode of the plurality of micro-LEDs.