Micro LED Structure for Fluidic Self-Alignment in Large Displays
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Solution Overview
Problem
The productivity of micro LED display apparatus manufacturing is lowered as the size of micro LED decreases and the size of the display apparatus increases, particularly due to the inefficiencies in the laser lift off or pick and place method.
Innovation Solution
A micro light emitting device with a structure suitable for alignment in a fluidic self-assembly method, featuring a first semiconductor layer, a light emitting layer, a second semiconductor layer, an insulating layer, and electrodes, along with an aluminum nitride layer, is developed to facilitate efficient assembly on a display substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If laser lift off or pick and place method is used for transferring micro LED, then micro LED can be transferred to display substrate, but productivity is lowered as the size of micro LED decreases and the size of display apparatus increases
Solution Approach 1:
The micro light emitting device structure enables self-alignment through the fluidic self-assembly method. The device structure itself facilitates alignment on the display substrate without requiring complex external alignment systems, allowing the system to align itself during the transfer process.
Solution Approach 2:
The patent replaces the mechanical laser lift off or pick and place transfer method with a fluidic self-assembly approach. This substitution eliminates the need for complex mechanical alignment systems and enables high-throughput transfer while maintaining precision through fluidic forces and surface energy interactions.
2Manufacturing precision
If the size of micro LED is decreased to achieve higher resolution, then display quality is improved, but transfer efficiency is reduced
Solution Approach 1:
The fluidic self-assembly method allows micro LEDs of any size to self-align and transfer efficiently. The self-service mechanism ensures that even sub-100 micrometer micro LEDs can transfer with high efficiency without requiring proportional increases in alignment complexity or transfer time.
Solution Approach 2:
The patent changes the fundamental transfer parameter from mechanical force (laser lift off) to fluidic and surface energy forces (fluidic self-assembly). This parameter change enables scaling to smaller micro LED sizes without proportionally reducing transfer efficiency, as the fluidic mechanism remains effective across different size scales.
3Quantity of substance
If the size of display apparatus is increased to meet market demand, then production capacity is improved, but alignment difficulty increases
Solution Approach 1:
The fluidic self-assembly method enables each micro light emitting device to self-align on the display substrate independently. This self-service alignment mechanism maintains consistent precision across the entire large-area display substrate, regardless of the total number of pixels or display size.
Solution Approach 2:
The patent segments the alignment process into individual micro light emitting device units that self-align independently. This segmentation allows parallel processing of alignment across the entire display substrate, enabling large-area displays to be manufactured with the same alignment precision as smaller displays.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The fluidic self-assembly method enables the efficient alignment and assembly of micro light emitting devices on a display substrate, enhancing the manufacturing productivity of large-area display apparatuses.
Implementation Method 1
a micro light emitting device having a structure suitable for alignment in a fluidic self assembly method
Data Source
AI summary
A micro light emitting device includes a first semiconductor layer doped with a first conductivity type, a light emitting layer arranged on an upper surface of the first semiconductor layer, a second semiconductor layer arranged on an upper surface of the light emitting layer and doped with a second conductivity type electrically opposite to the first conductivity type, an insulating layer arranged on an upper surface of the second semiconductor layer, a first electrode arranged on an upper surface of the insulating layer and electrically connected to the first semiconductor layer, a second electrode arranged on the upper surface of the insulating layer and electrically connected to the second semiconductor layer, and an aluminum nitride layer arranged on a lower surface of the first semiconductor layer and having a flat surface.