Micro LED Display Assembly Using Fluidic Self-Transfer

The invention divides the transfer process into two distinct stages: first, transferring multiple micro LEDs simultaneously onto a temporary substrate in a batch process; second, transferring the complete micro LED array from the temporary substrate to the final display substrate. This segmentation enables high-volume transfer operations that maintain productivity even as individual micro LED sizes decrease and display areas increase.

The invention introduces a temporary substrate as an intermediary carrier between the micro LED source and the final display substrate. This temporary substrate serves as a holding platform that allows batch assembly of micro LEDs before final transfer, effectively decoupling the transfer process into manageable stages that preserve productivity.

The invention separates the TFT formation process from the micro LED transfer process by introducing a temporary substrate. TFTs can be formed on the temporary substrate with various types and configurations independent of the final display substrate constraints. This segmentation allows flexibility in TFT design and selection that would otherwise be limited by the backplane substrate specifications.

The temporary substrate serves multiple functions: it acts as a platform for forming various types of TFTs, a carrier for batch transferring micro LEDs, and an intermediary for subsequent transfer to different display substrates. This multi-functionality enables the system to accommodate diverse TFT types and substrate sizes without requiring dedicated processing lines for each configuration.

The invention segments the transfer operation into batch processes on a temporary substrate, allowing precise alignment and connection of multiple micro LEDs simultaneously. This batch approach maintains high connection accuracy by establishing all connections in a controlled, single-step process rather than sequential individual transfers, thereby preventing connection errors even for large-area displays.

The invention replaces conventional mechanical pick-and-place transfer methods with a batch transfer mechanism that utilizes temporary substrate bonding and release techniques. This substitution eliminates the mechanical positioning and placement errors inherent in sequential transfer methods, achieving high connection reliability across large display areas through a more controlled transfer mechanism.