Micro LED Display Module Non-Conductive Fluxing Layer
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Solution Overview
Problem
Micro LEDs face challenges in manufacturing due to fine size issues, such as solder shorts and unstable contact, requiring additional processes like flux cleaning and under-fill filling, which are not always effective.
Innovation Solution
A method involving a non-conductive layer with a fluxing function is formed on a substrate, where micro LEDs are thermally compressed with soldering members between electrode pads and connection pads, allowing the non-conductive layer to fill gaps and prevent electrical shorts, simplifying the manufacturing process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If soldering is used to connect micro LEDs to the substrate, then electrical connection is achieved, but solder shorts between adjacent solders occur due to extremely fine size
Solution Approach 1:
A non-conductive layer is introduced as an intermediary substance between adjacent soldering members. This layer physically separates the solders and prevents electrical shorts while allowing the soldering members to maintain electrical connection to the micro LED electrode pads. The non-conductive layer acts as a mediator that resolves the contradiction between achieving electrical connection and preventing harmful electrical shorts.
Solution Approach 2:
The space between adjacent micro LEDs and between soldering members is segmented by the non-conductive layer. This segmentation creates distinct electrical zones, preventing current leakage between adjacent components. The non-conductive layer divides the continuous conductive path into isolated segments, ensuring that electrical current flows only through intended paths.
2Reliability
If flux is used during soldering to prevent oxidation, then oxidation is prevented, but additional flux cleaning process is required
Solution Approach 1:
The fluxing function is merged with the non-conductive layer structure. Instead of applying flux as a separate substance that requires cleaning, the non-conductive layer itself is designed to perform fluxing functions during soldering. This merging eliminates the need for separate flux application and cleaning steps, reducing manufacturing process complexity while maintaining oxidation prevention benefits.
Solution Approach 2:
The non-conductive layer serves multiple functions simultaneously: it provides electrical insulation between soldering members, acts as a fluxing agent during soldering to prevent oxidation, and serves as a structural support element. This multi-functionality reduces the number of separate components and processes needed, simplifying the overall manufacturing process.
3Object-affected harmful factors
If under-fill and side-fill resinous materials are applied to prevent shorts, then short prevention is attempted, but filling is incomplete due to fine size of micro LEDs
Solution Approach 1:
The non-conductive layer serves as an intermediary barrier that proactively prevents the need for complete filling operations. By placing this insulating layer strategically between soldering members and micro LEDs, electrical shorts are prevented without requiring resinous materials to completely fill all gaps. The intermediary layer provides sufficient insulation even in partially filled regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach stabilizes the electrical connection of micro LEDs, reduces manufacturing complexity and costs, and ensures uniform brightness by preventing electrical shorts and maintaining the micro LEDs' position without affecting their light emission.
Implementation Method 1
a non-conductive layer provided on the substrate, and configured to fill gaps between the plurality of soldering members
Implementation Method 2
thermally compressing the plurality of LEDs
Data Source
AI summary
A display module, a display apparatus including a display module, and a method of manufacturing a display module are provided. The method of manufacturing a display module includes forming a non-conductive layer that includes a fluxing function on a substrate, providing a plurality of light-emitting diodes (LEDs) on the substrate, wherein each LED of the plurality of LEDs has a first electrode pad and a second electrode pad spaced apart by a predetermined interval, and the substrate has a plurality of connection pads that are configured to electrically connect to the first electrode pads and the second electrode pads; thermally compressing the plurality of LEDs; and electrically connecting the plurality of LEDs and the substrate via a plurality of soldering members that are provided on at least one of the plurality of LEDs or the substrate.