Micro LED Arrays on Glass for High-Temperature Optical Links
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Future serializer/deserializer (SerDes) requirements increase power consumption in electrical and optical communications, and reducing the SerDes distance between the electrical die and the photonic engine is limited by thermal performance issues with existing group III-V semiconductor lasers, which fail above certain temperatures.
Innovation Solution
Employing micro light emitting diodes (LEDs) on glass or silicon substrates, compatible with higher temperatures, to provide light for the system, reducing power consumption and thermal degradation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If the SerDes distance between the electrical die and the photonic engine is decreased, then power consumption is reduced, but thermal performance deteriorates because the laser stops functioning above certain temperatures
Solution Approach 1:
The patent changes the operating temperature parameter range by selecting micro LEDs that can operate at higher temperatures (up to 250°C) compared to conventional lasers. This allows the photonic engine to be positioned closer to the electrical die, reducing SerDes distance and power consumption while maintaining reliability in the high-temperature environment near the electrical die.
Solution Approach 2:
The patent uses micro LEDs as a substitute light source that replicates the function of conventional lasers but with improved thermal characteristics. The micro LED array copies the light generation function while operating reliably at higher temperatures, enabling reduced SerDes distance without thermal performance degradation.
2Illumination intensity
If conventional group III-V semiconductor lasers are used, then light generation is achieved, but thermal stability is poor above 80°C
Solution Approach 1:
The patent changes the material composition and operational parameters of the light source by using micro LEDs instead of conventional lasers. Micro LEDs maintain their light generation capability at elevated temperatures up to 250°C, fundamentally changing the temperature parameter range where reliable operation occurs.
Solution Approach 2:
The patent employs micro LEDs fabricated on glass or silicon substrates, creating a composite structure that combines the light-emitting micro LED elements with thermally stable substrate materials. This composite approach enables the system to withstand high temperatures while maintaining light generation functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Micro LEDs maintain performance up to 250°C, offering low power consumption (0.1-0.5 pJ/bit) and improved thermal stability compared to silicon photonics, enabling reduced SerDes distances.
Implementation Method 1
an array of micro light emitting diodes (LEDs) over the transistor
Implementation Method 2
micro light emitting diodes (LEDs) on glass or silicon substrates, compatible with higher temperatures, to provide light for the system
Data Source
AI summary
Embodiments disclosed herein include optical communication modules and optoelectronic packages. In an embodiment, an optical communication module comprises a substrate, a transistor over the substrate, an array of micro light emitting diodes (LEDs) over the transistor, and a connector over the array of micro LEDs.