Micro LED IC Package With Glass TGV Power Routing
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Solution Overview
Problem
Existing DIY electronic devices lack efficient methods to integrate micro LEDs for both aesthetic and functional purposes, limiting customization options and profit margins.
Innovation Solution
The integration of micro LEDs into an IC package using a glass substrate with through glass vias and a package substrate, where the micro LEDs are powered through conductive structures, allowing for various color options and aesthetic effects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If micro LEDs are integrated into IC package using glass substrate with through glass vias, then customization options and profit margins increase, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The IC package is segmented into distinct functional layers: glass substrate layer, semiconductor die layer, and package substrate layer. Through glass vias are created as separate conductive pathways through the glass substrate, allowing independent routing and connection schemes. This segmentation enables flexible customization of micro LED configurations while maintaining manageable complexity through modular assembly.
Solution Approach 2:
The patent utilizes vertical stacking in the Z-dimension to integrate multiple functions: micro LEDs are mounted on the glass substrate, which is then bonded to the package substrate with conductive vias extending vertically. This three-dimensional integration allows complex electrical connections and optical pathways without increasing lateral footprint, enabling customization without proportional increases in device complexity.
2Adaptability or versatility
If micro LEDs are integrated into IC package with through glass vias, then visual appeal and functionality improve, but manufacturing precision requirements increase
Solution Approach 1:
Conductive structures are formed within the glass substrate and package substrate before bonding the layers together. Through glass vias are prepared in advance with precise positioning, and the glass substrate is pre-aligned with the package substrate using registration features. This preliminary preparation of conductive pathways and alignment structures ensures high manufacturing precision during the bonding process while enabling aesthetic micro LED integration.
3Quantity of substance
If micro LEDs are added to electronic devices for customization, then profit margins increase, but integration time and production complexity increase
Solution Approach 1:
The patent combines multiple manufacturing operations into integrated process steps: the glass substrate serves simultaneously as the mounting platform for micro LEDs, as the structural support layer, and as the pathway carrier for conductive vias. The bonding process merges alignment, electrical connection, and mechanical attachment into a single operation. This merging of functions and processes reduces the number of discrete steps required, thereby increasing productivity while maintaining the customization capabilities that drive profit margins.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables enhanced customization and increased profit margins by providing a robust and visually appealing integration of micro LEDs within electronic devices, improving both functionality and aesthetics.
Implementation Method 1
a semiconductor die that includes a micro light emitting diode (LED)
Data Source
AI summary
Embodiments of an integrated circuit (IC) package are disclosed. In some embodiments, the IC package includes a semiconductor die, a glass substrate, and a package substrate. The semiconductor die includes a micro light emitting diode (LED). The semiconductor die is at least partially embedded within the glass substrate and the glass substrate including a through glass via (TGV) embedded in the glass substrate wherein the TGV is electrically coupled to the semiconductor die to provide power to the micro LED. The package substrate that is coupled to the TGV.