Micro-LED Array Groove Alignment for Faster Batch Transfer
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Solution Overview
Problem
The existing methods for transferring micro-LEDs onto a driving circuit substrate are inefficient, particularly as the size of the micro-LEDs decreases and the display area increases, leading to increased time and costs due to the need for precise alignment and multiple transfer processes.
Innovation Solution
A method involving a substrate with circular grooves and micro-LEDs with strategically positioned electrodes allows for efficient alignment by positioning electrodes towards the grooves, enabling bonding with corresponding electrode structures on the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional pick and place method is used to transfer micro-LEDs, then transfer capability is achieved, but productivity decreases as micro-LED size decreases and display area increases
Solution Approach 1:
The invention segments the transfer process by introducing an intermediate mold substrate with multiple grooves that can simultaneously hold and align multiple micro-LEDs. This allows batch transfer of multiple micro-LEDs at once, dramatically improving productivity compared to transferring one micro-LED at a time with traditional pick and place methods
Solution Approach 2:
The mold substrate is prepared in advance with grooves positioned at precise locations corresponding to the driving circuit substrate. Micro-LEDs are pre-aligned in these grooves before the actual transfer to the driving circuit substrate, which simplifies the final transfer operation and improves overall process efficiency
2Adaptability or versatility
If multiple transfer processes are used to transfer micro-LEDs emitting multiple colors, then color diversity is achieved, but manufacturing time increases
Solution Approach 1:
The invention merges multiple transfer operations into a single integrated process. The mold substrate can simultaneously hold micro-LEDs of different colors (red, green, blue) in separate grooves, allowing all color types to be transferred in one batch operation rather than requiring separate transfer processes for each color
Solution Approach 2:
The mold substrate serves multiple functions: it acts as a holding structure for micro-LEDs of various colors, an alignment reference with precisely positioned grooves, and a transfer medium. This multi-functional design enables simultaneous handling of different colored micro-LEDs, reducing the number of separate transfer processes needed
3Manufacturing precision
If micro-LEDs are aligned with grooves on driving circuit substrate, then alignment precision is improved, but device complexity increases
Solution Approach 1:
The mold substrate acts as an intermediary between the micro-LED fabrication process and the final mounting on the driving circuit substrate. The grooves on the mold substrate provide the alignment reference, while the corresponding grooves on the driving circuit substrate receive the pre-aligned micro-LEDs. This intermediary approach achieves high precision without requiring complex direct alignment mechanisms between micro-LEDs and the driving circuit substrate
Data Source
AI summary
A method of manufacturing a micro-light-emitting diode (LED) array includes: providing a first substrate including a plurality of circular grooves formed on a first surface thereof; supplying a plurality of micro-LEDs onto the first surface of the first substrate; and aligning the plurality of micro-LEDs with the plurality of circular grooves, wherein at least two electrodes are formed on a second surface of each of the plurality of micro-LEDs to be apart from each other, and the at least two electrodes include a first electrode formed to be relatively close to a center of the second surface and at least one second electrode formed at an edge of the second surface.