Micro-LED Transfer Substrate With Selective Groove Exposure
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Solution Overview
Problem
The existing pick-and-place method for transferring micro-light emitting diodes (LEDs) is inefficient, especially when dealing with smaller LEDs and larger displays, and requires repeated processes for multi-color LEDs, leading to low productivity and prolonged transfer times.
Innovation Solution
A method involving a transfer substrate with grooves and selectively removable transfer prevention films, where different color LEDs are transferred into corresponding grooves by removing specific films using organic or alkaline solutions, allowing for sequential transfer without size or shape limitations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the pick-and-place method is used to transfer micro-light emitting diodes, then the transfer process can be performed with simple equipment, but the productivity is low and the transfer time is prolonged when the size of micro-light emitting diodes is decreased and the size of display is increased
Solution Approach 1:
The transfer substrate is divided into multiple grooves, each capable of holding a micro-LED. Multiple micro-LEDs are transferred simultaneously in one operation rather than individually, thereby increasing productivity and reducing total transfer time while maintaining equipment simplicity
Solution Approach 2:
The grooves are pre-formed on the transfer substrate before the transfer process. This preliminary structuring allows micro-LEDs to be directly placed into designated positions simultaneously, eliminating the need for sequential positioning and improving transfer efficiency
2Manufacturing precision
If the pick-and-place method is used to transfer micro-light emitting diodes that emit a plurality of color lights, then each color can be transferred separately, but the transferring process needs to be repeated as many times as the number of colors
Solution Approach 1:
Multiple grooves for different color micro-LEDs are integrated on a single transfer substrate. All color micro-LEDs are transferred in one simultaneous operation rather than through repeated separate processes, improving productivity while maintaining color placement accuracy through the structured groove arrangement
Solution Approach 2:
The transfer substrate with multiple grooves serves multiple functions: it can hold and transfer micro-LEDs of different colors simultaneously, and the grooves can be selectively exposed to transfer only specific colors as needed. This multi-functionality eliminates the need for repeated transferring while maintaining precision
3Ease of operation
If transfer prevention films are formed on specific grooves to enable selective transfer, then the transfer process becomes more controllable, but the process complexity increases
Solution Approach 1:
Transfer prevention films are selectively removed from specific grooves to enable transfer of particular color micro-LEDs while leaving other grooves protected. This selective extraction approach provides precise control over which micro-LEDs are transferred without requiring complex equipment modifications
Solution Approach 2:
Different grooves have different transfer prevention film removal states - some grooves have films removed while others retain films. This local differentiation enables selective transfer control for different colors or positions, providing operational flexibility with relatively simple process steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables efficient and rapid transfer of micro-light emitting diodes emitting different colors onto a single substrate, improving productivity and reducing transfer time by selectively removing films to expose and fill grooves, facilitating the manufacturing of micro-light emitting diode display devices.
Implementation Method 1
removing the first transfer prevention film formed on the second groove; The first transfer prevention film may be removable by an organic solution
Implementation Method 2
removing the second transfer prevention film formed on the third groove; the second transfer prevention film is removable by an alkali solution
Implementation Method 3
The transferring of the first micro-light emitting diode, the second micro-light emitting diode, and the third micro-light emitting diode may include supplying a liquid into the first groove, the second groove, and the third groove, supplying a corresponding micro-light emitting diode, among the first micro-light emitting diode, the second micro-light emitting diode, and the third micro-light emitting diode, on to the transfer substrate, and scanning the transfer substrate with an absorbent that absorbs the liquid
Data Source
AI summary
A method of transferring micro-light emitting diodes is provided. The method includes preparing a transfer substrate including a first groove, a second groove, and a third groove; forming a first transfer prevention film on the second groove and forming a second transfer prevention film on the third groove; transferring, into the first groove, a first micro-light emitting diode configured to emit a first color light; removing the first transfer prevention film formed on the second groove; transferring, into the second groove, a second micro-light emitting diode configured to emit a second color light; removing the second transfer prevention film formed on the third groove; and transferring, into the third groove, a third micro-light emitting diode configured to emit a third color light.