Micro LED Transfer Guiding Mold for Accurate Pixel Placement
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Solution Overview
Problem
The existing methods for manufacturing high-resolution display devices using micro light emitting diodes (LEDs) face challenges in efficiently transferring and positioning LEDs on substrates, leading to misalignment and reduced transfer efficiency.
Innovation Solution
A display device design incorporating a transfer guiding mold with specific height and structural features, such as concave-convex surfaces and reflective layers, to guide and position micro LEDs accurately, prevent crosstalk, and facilitate easy removal of misplaced LEDs, while using photoconversion material layers to adjust light wavelengths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional transfer process is used without a transfer guiding mold, then the manufacturing process is simpler, but the transfer efficiency and positioning accuracy of micro LEDs are reduced
Solution Approach 1:
The transfer guiding mold is divided into a body portion and a lid portion that can be separated. The body portion contains recesses for receiving micro LEDs, while the lid portion can be attached to enclose the micro LEDs during transfer. This segmentation allows the mold to provide precise positioning guidance while maintaining ease of operation for loading and unloading micro LEDs, resolving the contradiction between positioning accuracy and operational simplicity.
Solution Approach 2:
The transfer guiding mold acts as an intermediary device between the micro LED source and the substrate. It provides a controlled environment with specific recesses and guiding structures that ensure accurate positioning during transfer, while the separable design allows easy access for loading and unloading, thus improving positioning accuracy without significantly increasing operational complexity.
2Reliability
If the transfer guiding mold has a height greater than twice the micro LED height, then the mold provides better structural stability, but the misplaced micro LEDs cannot be easily removed
Solution Approach 1:
The transfer guiding mold employs a dynamic height design where the body portion height is specifically controlled to be less than twice the micro LED height. This dynamic dimension allows misplaced micro LEDs to be easily removed by applying minimal force, while the overall structure maintains sufficient stability through the lid portion and recess design. This resolves the contradiction between structural stability and ease of removing misplaced LEDs.
Solution Approach 2:
The patent specifies a particular parameter range for the body portion height (less than twice the micro LED height) to optimize both structural stability and ease of operation. This parameter change allows the mold to provide adequate support for micro LEDs during transfer while enabling easy removal of misplaced LEDs by applying minimal force, thus resolving the contradiction between reliability and ease of operation.
3Reliability
If no reflective layers are provided in the transfer guiding mold, then the manufacturing process is simpler, but crosstalk between adjacent micro LEDs occurs
Solution Approach 1:
Reflective layers are applied locally at specific positions within the transfer guiding mold, particularly in the recesses where micro LEDs are received. This localized application prevents crosstalk between adjacent micro LEDs by reflecting light laterally, while avoiding unnecessary reflective layers in other areas. This resolves the contradiction between crosstalk prevention and manufacturing simplicity by applying complexity only where needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the transfer efficiency and accuracy of micro LEDs on substrates, reduces crosstalk between pixels, and allows for effective removal of misplaced LEDs, thereby improving the overall quality and efficiency of the display device manufacturing process.
Implementation Method 1
at least some of the plurality of micro LEDs are provided with a photoconversion material layer configured to convert a wavelength of an incidence light
Implementation Method 2
a first reflective layer provided on the transfer guiding mold between the plurality of micro LEDs
Data Source
AI summary
Provided is a display device including a substrate, a transfer guiding mold provided on the substrate and including a plurality of openings, and a plurality of micro light emitting diodes (LEDs) provided on the substrate in the plurality of openings, wherein a height of the transfer guiding mold is less than twice a height of each of the plurality of micro LEDs.