Micro LED Display Panel Heat Dissipation Structure
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Solution Overview
Problem
The high temperature in micro LED display panels leads to rapid proliferation of defects in the chip material, reducing light-emitting efficiency and service life, as these defects invade the light-emitting layer and shorten the lifespan of the micro LED.
Innovation Solution
Incorporating a metal structure between the substrate and the source-drain layer, where the source or drain of the thin film transistor is electrically connected to the micro LED's electrode, acts as a heat dissipation structure to reduce the micro LED's temperature and mitigate defect invasion into the light-emitting layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the micro LED is directly bound to the array substrate with driving circuit, then the device complexity is reduced, but the temperature of the micro LED increases causing defects to proliferate and light-emitting efficiency to decrease
Solution Approach 1:
The patent introduces an intermediary heat dissipation structure between the micro LED and the array substrate. This intermediate layer acts as a thermal mediator that conducts heat away from the micro LED while maintaining the direct bonding structure, thus resolving the contradiction between structural simplicity and light-emitting efficiency.
Solution Approach 2:
The patent extracts the heat dissipation function from the array substrate itself and separates it into a dedicated heat dissipation structure. This allows the substrate to focus on its primary function of providing driving circuits while the specialized heat dissipation structure handles thermal management, preventing defect proliferation in the micro LED.
2Ease of manufacture
If the micro LED is directly bound to the array substrate, then the manufacturing process is simplified, but the service life of the micro LED is reduced due to high temperature defects
Solution Approach 1:
The heat dissipation structure serves as a mediator between the micro LED and the substrate, enabling the simple direct-bonding manufacturing process to coexist with extended micro LED service life by actively managing thermal effects during operation.
Solution Approach 2:
The patent incorporates the heat dissipation structure in advance during the manufacturing process, providing thermal protection to the micro LED before defects can proliferate. This preemptive thermal management cushions against the harmful effects of high temperature, extending service life without complicating manufacturing.
3Device complexity
If high temperature operation is tolerated for simplified structure, then device complexity is reduced, but defects invade the light-emitting layer reducing light-emitting efficiency
Solution Approach 1:
The patent converts the harmful high temperature effect into a beneficial thermal conduction path by introducing the heat dissipation structure. The same thermal energy that would cause defect proliferation is instead channeled through the heat dissipation structure to the substrate, transforming a harmful factor into a manageable thermal flow that maintains structural simplicity while preventing damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the micro LED's temperature, enhancing its light-emitting efficiency and service life by preventing defect-induced degradation in the light-emitting layer.
Implementation Method 1
the source or the drain of the first thin film transistor electrically connected to the first electrode of the micro LED and the metal structure electrically connected to the first electrode of the micro LED are used as a heat dissipation structure of the micro LED so that a temperature of the micro LED is effectively reduced
Data Source
AI summary
Provided are a display panel and a display device. The display panel includes a substrate and a plurality of pixel units disposed on the substrate. Each pixel unit includes a driving circuit and a light-emitting component, the driving circuit is disposed between the substrate and the light-emitting component, and the driving circuit is used for driving a corresponding light-emitting component to emit light. At least one light-emitting component is a micro Light Emitting Diode (LED). For a pixel unit in which the light-emitting component is the micro LED, the driving circuit at least includes a first thin film transistor, and a source and a drain of the first thin film transistor are disposed in a source-drain layer. A first electrode of the micro LED is electrically connected to a source or a drain of a corresponding first thin film transistor.