Micro LED Holding Structure with Varying Thickness for Transfer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for transferring micro light emitting diodes (LEDs) are hindered by the size and shape of the contact area between the holding structure and the micro LED, affecting the yield rate of delivery and transfer.
Innovation Solution
A micro device structure with a holding structure that has a varying thickness from the boundary between the top surface and the peripheral surface to the substrate, allowing for controlled breaking points and improved transfer efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the contact area between the holding structure and the micro LED is made larger to improve holding strength, then the micro LED can be held more securely during transfer, but the yield rate of delivery and transfer decreases due to incomplete breakage of the holding structure
Solution Approach 1:
The holding structure implements local quality by having different thicknesses in different regions: a first thickness in the contact area with the micro LED providing strong holding force, and a second thickness (smaller than the first) in the breaking area ensuring clean breakage. This spatial variation in structural properties resolves the contradiction between needing strong holding and clean release.
Solution Approach 2:
The holding structure is segmented into functionally distinct regions: a holding area with greater thickness for secure attachment, and a breaking area with smaller thickness for controlled fracture. This segmentation allows each region to optimize its performance for its specific function, enabling both strong holding and reliable release.
2Ease of operation
If the contact area between the holding structure and the micro LED is made smaller to facilitate easier breakage, then the transfer process becomes simpler, but the holding strength is insufficient to securely hold the micro LED during transfer
Solution Approach 1:
The holding structure implements local quality by having different thicknesses in different regions: a first thickness in the contact area with the micro LED providing strong holding force, and a second thickness (smaller than the first) in the breaking area ensuring clean breakage. This spatial variation in structural properties resolves the contradiction between needing strong holding and clean release.
Solution Approach 2:
The holding structure is segmented into functionally distinct regions: a holding area with greater thickness for secure attachment, and a breaking area with smaller thickness for controlled fracture. This segmentation allows each region to optimize its performance for its specific function, enabling both strong holding and reliable release.
Data Source
AI summary
A structure with micro device including a substrate, at least one micro device and at least one holding structure is provided. The micro device is disposed on the substrate and has a top surface away from the substrate, a bottom surface opposite to the top surface, and a circumferential surface connecting the top surface and the bottom surface. The holding structure is disposed on the substrate. From the cross-sectional view, a thickness of the holding structure is not fixed from the boundary of the top surface and the circumferential surface to the substrate. The micro device is connected to the substrate through the holding structure.