Micro-LED Intermetallic Bonding for Display Substrates
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Solution Overview
Problem
The existing methods for manufacturing display apparatuses using micro-LEDs are complex and involve complicated bonding processes, making it difficult to reliably connect light-emitting devices with driving substrates.
Innovation Solution
A display apparatus is designed with a light-emitting device and a driving substrate, where a metal layer with an intermetallic compound connects the device-side electrode to the driver-side electrode, and a resin layer with anisotropic conductivity is used to facilitate the bonding process, including the use of specific alloys and electrode materials like graphene, gold, and silver, and a bump formed using anisotropic conductive paste to ensure reliable connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If stepped portions are formed on the backplane substrate to connect light-emitting devices for each stepped portion, then the light-emitting devices can be connected to the driving substrate, but the manufacturing process becomes complicated
Solution Approach 1:
The metal layer is divided into multiple segments corresponding to different stepped portions of the backplane substrate. Each segment connects to a specific stepped portion, allowing independent connection of light-emitting devices to different height levels without requiring a complex overall restructuring of the substrate
Solution Approach 2:
The metal layer acts as an intermediary element between the light-emitting devices and the driving substrate. It provides a flexible connection medium that can adapt to the stepped structure, simplifying the manufacturing process by eliminating the need for complex stepped substrate fabrication while maintaining reliable electrical connections
2Reliability
If a metal layer with intermetallic compound is used to connect electrodes, then bonding reliability is enhanced, but manufacturing precision requirements increase
Solution Approach 1:
The intermetallic compound is formed in advance during the metal layer deposition process, creating pre-formed bonding interfaces with optimal properties. This preliminary formation of the intermetallic compound ensures reliable bonding without requiring high-precision post-processing, as the compound self-organizes at the electrode interfaces
Solution Approach 2:
The physical and chemical parameters of the metal layer are optimized to control intermetallic compound formation. By adjusting composition, thickness, and deposition conditions, the bonding reliability is enhanced while maintaining manufacturability through controlled material properties rather than relying solely on precision positioning
3Measurement precision
If micro-LEDs with small electrode dimensions are used, then display resolution is improved, but bonding difficulty increases
Solution Approach 1:
The metal layer is designed as a composite structure combining different metal materials to achieve both fine pitch compatibility and bonding reliability. The composite material properties enable effective bonding of micro-LEDs with small electrode dimensions while maintaining ease of manufacture through optimized material characteristics such as ductility, adhesion, and intermetallic compound formation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies the bonding process, enhances electrical conductivity, and allows for the efficient transfer and connection of micro-LEDs to the driving substrate, reducing manufacturing costs and improving productivity while maintaining high resolution and precision.
Implementation Method 1
a metal layer configured to connect the device-side electrode to the driver-side electrode, and including a first interface between the metal layer and the device-side electrode, and a second interface between the metal layer and the driver-side electrode, wherein at least one of the first interface and the second interface includes an intermetallic compound
Implementation Method 2
a resin layer with anisotropic conductivity is used to facilitate the bonding process
Data Source
AI summary
A display apparatus, including a light-emitting device including a device-side electrode; a driving substrate configured to drive the light-emitting device; a driver-side electrode provided on the driving substrate; and a metal layer configured to connect the device-side electrode to the driver-side electrode, and including a first interface between the metal layer and the device-side electrode, and a second interface between the metal layer and the driver-side electrode, wherein at least one of the first interface and the second interface includes an intermetallic compound.