Micro LED Mesa Structure With Ion Isolation for Crosstalk Control
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Solution Overview
Problem
Micro light emitting diodes (μ-LEDs) face challenges such as red-shift, low maximum efficiency, inhomogeneous emission, and decreased external and internal quantum efficiencies due to issues like carrier spreading, crosstalk, and nonradiative recombination at unetched quantum well sidewalls.
Innovation Solution
A micro LED structure is designed with a mesa structure comprising a first semiconductor layer, a light emitting layer, and a second semiconductor layer, along with a sidewall protective layer and a sidewall reflective layer. The second semiconductor layer includes a semiconductor region and an ion implantation region with higher resistance, and the structure is electrically coupled to an integrated circuit (IC) back plane.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If space is formed between adjacent μ-LEDs to avoid carrier spreading, then carrier isolation is improved, but active light emitting area is reduced and light extraction efficiency decreases
Solution Approach 1:
The patent introduces an ion implantation region as an intermediary zone between the semiconductor region and adjacent structures. This region has modified electrical properties through ion implantation that creates a potential barrier, effectively blocking carrier diffusion while occupying minimal space. The intermediary layer prevents direct carrier spreading to adjacent mesas without requiring large spacing, thus resolving the contradiction between carrier isolation and active area maintenance.
2Area of stationary object
If space between adjacent mesas is eliminated to increase active light emitting area, then active area is improved, but carrier spreading occurs and light emitting efficiency decreases
Solution Approach 1:
The ion implantation region serves as a spatial intermediary that enables close positioning of adjacent mesas while preventing carrier diffusion. By modifying the electrical properties of the semiconductor material through ion implantation, a potential barrier is created that blocks carrier spreading without requiring physical separation. This allows maximum active area utilization while maintaining light emitting efficiency through effective carrier confinement.
3Ease of manufacture
If quantum well sidewalls are not properly etched, then manufacturing complexity is reduced, but nonradiative recombination occurs and quantum efficiency decreases
Solution Approach 1:
The patent introduces a sidewall protective layer as an intermediary structure that covers the quantum well sidewalls. This protective layer prevents direct exposure of the sidewalls to the environment, eliminating the need for complex etching processes to achieve smooth sidewalls. The protective layer acts as a barrier that prevents nonradiative recombination at the sidewall interface, thereby maintaining high quantum efficiency while simplifying the manufacturing process.
4Illumination intensity
If current density is increased in small LED pixels, then brightness is improved, but red-shift occurs and efficiency decreases
Solution Approach 1:
The patent modifies the electrical parameters of the semiconductor region through ion implantation, changing the resistance characteristics in specific zones. This parameter modification creates a more favorable current distribution profile that allows high brightness operation without the adverse effects of excessive current density. The ion implantation region adjusts the local electrical properties to prevent carrier accumulation that causes red-shift, thereby maintaining emission quality at high brightness levels.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed micro LED structure enhances light extraction efficiency, reduces crosstalk, and improves quantum efficiencies, leading to more reliable and accurate μ-LEDs with increased active light emitting area.
Implementation Method 1
a sidewall reflective layer formed on the surface of the sidewall protective layer
Implementation Method 2
The second semiconductor layer further includes a semiconductor region and an ion implantation region formed around the semiconductor region, the ion implantation region having a resistance higher than a resistance of the semiconductor region
Implementation Method 3
The μ-LEDs have greater output performance than conventional LEDs due to better strain relaxation, improved light extraction efficiency, uniform current spreading, etc.
Data Source
AI summary
A micro light emitting diode (LED) structure, includes a mesa structure. The mesa structure further includes a first semiconductor layer having a first conductive type, a light emitting layer formed on the first semiconductor layer, a second semiconductor layer formed on the light emitting layer, the second semiconductor layer having a second conductive type different from the first conductive type. The second semiconductor layer further includes a semiconductor region and an ion implantation region formed around the semiconductor region, the ion implantation region having a resistance higher than a resistance of the semiconductor region.


