Micro LED Array Transfer with Isolated Emitting Regions
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Solution Overview
Problem
Conventional methods for manufacturing micro LED display arrays face challenges in reducing die size, leading to decreased light emitting efficiency due to edge deterioration and complex, costly manufacturing processes.
Innovation Solution
A method involving the formation of a semiconductor stacked layer on a substrate, with an insulating layer and electrode pads that are transferred to a driving backplane, where the electrode pads are electrically connected through openings in the insulating layer to create isolated light emitting regions, avoiding the need for patterning and etching processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of micro LED die is reduced to nanometer scale, then the display array can achieve higher resolution and smaller size, but the light emitting efficiency deteriorates due to edge effects accounting for considerable portion of overall efficiency
Solution Approach 1:
The patent divides the semiconductor stacked layer into multiple independent light emitting regions by forming separate electrode pads for each region. Each light emitting region is electrically isolated and can be independently controlled, allowing the large stacked layer to function as multiple smaller emitting units, thereby reducing edge effect impact on overall efficiency.
Solution Approach 2:
The patent applies different properties to different parts of the semiconductor stacked layer by forming insulating layers selectively between light emitting regions. This creates localized electrical isolation that maintains high efficiency in each region while allowing the overall structure to remain large in size.
2Manufacturing precision
If conventional manufacturing processes are used for micro LED arrays including cutting or patterning dies in advance, then different light emitting platforms can be defined, but the manufacturing process becomes complicated and cost increases
Solution Approach 1:
Instead of the conventional approach of first cutting/patterning dies to define light emitting platforms and then forming electrodes, this patent inverts the sequence by first forming the complete semiconductor stacked layer with all necessary electrodes and insulating layers, and then defining light emitting regions through the electrode pad arrangement. This eliminates the need for preliminary die cutting and simplifies the manufacturing process.
Solution Approach 2:
The patent combines multiple manufacturing steps into a unified process where the semiconductor stacked layer is formed as a single continuous structure with integrated electrodes and insulating layers. This merging of steps eliminates the need for separate die cutting, patterning, and assembly operations, thereby reducing manufacturing complexity.
3Ease of manufacture
If conventional manufacturing processes including common electrode formation, planarization, and mass transfer are used, then micro LED arrays can be manufactured, but the manufacturing process is complicated and cost is high
Solution Approach 1:
The patent performs preliminary formation of the complete semiconductor stacked layer structure including all electrodes and insulating layers on a single substrate before any transfer or assembly operations. This preliminary action eliminates the need for subsequent common electrode formation and planarization steps that are required in conventional processes.
Solution Approach 2:
The semiconductor stacked layer structure is designed to serve multiple functions simultaneously: it provides the light emitting regions, contains all necessary electrodes for electrical connection, includes insulating layers for electrical isolation, and maintains structural integrity for direct transfer to the substrate. This multi-functionality eliminates the need for separate common electrode formation and planarization processes.
Data Source
AI summary
A method for manufacturing a display array includes the following steps: providing a substrate and forming a semiconductor stacked layer on the substrate; forming an insulating layer and a plurality of electrode pads on an outer surface of the semiconductor stacked layer, the insulating layer and the electrode pads directly contacting the semiconductor stacked layer, wherein the insulating layer has a plurality of openings spaced apart from each other; and transferring the semiconductor stacked layer, the insulating layer and the electrode pads from the substrate to a driving backplane, wherein the electrode pads are respectively electrically connected to the driving backplane through the openings of the insulating layer to form a plurality of light emitting regions in the semiconductor stacked layer as the electrode pads and the semiconductor stacked layer are energized by the driving backplane.