Micro Light Emitting Device Display Isolation Layer
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Solution Overview
Problem
The manufacturing yield of micro light emitting diode displays is hindered by the risk of short-circuiting during the transfer process due to the overflow of connection pads, which affects the transfer success rate and overall cost effectiveness.
Innovation Solution
A micro light emitting device display apparatus is designed with an isolation layer between the micro light emitting devices and an air gap between the isolation layer and the substrate, which serves as a buffer space during the bonding process, improving the transfer success rate and bonding yield by preventing short circuits and ensuring proper alignment and adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the micro light emitting diode is miniaturized to reduce manufacturing cost, then the device size and cost are reduced, but the distance between electrode pads is shortened causing short-circuit risk during transfer
Solution Approach 1:
An isolation layer is introduced as an intermediary structure between adjacent micro light emitting devices. This isolation layer includes a first portion connected to the micro light emitting devices and a second portion connected to the substrate, creating a physical barrier that prevents short-circuits between adjacent devices during the transfer process while maintaining miniaturization benefits
Solution Approach 2:
The isolation layer extends in the vertical dimension (height direction) between adjacent micro light emitting devices. By adding this vertical dimension of isolation, the patent prevents horizontal short-circuits without increasing the planar footprint, thus maintaining device miniaturization while improving transfer reliability
2Strength
If the connection pads are heated to molten state for bonding, then the bonding strength is improved, but the connection pads overflow causing short-circuits
Solution Approach 1:
The isolation layer is formed beforehand on the substrate before the micro light emitting devices are transferred and bonded. This pre-formed isolation structure acts as a cushion or barrier that contains any overflow of molten connection pads, preventing short-circuits while allowing the bonding process to proceed with adequate heating for strong adhesion
3Productivity
If the distance between electrode pads is shortened for miniaturization, then the device density is increased, but the short-circuit risk during transfer increases
Solution Approach 1:
The isolation layer segments the continuous substrate surface into isolated regions for each micro light emitting device. This segmentation creates discrete isolation zones between adjacent devices, allowing higher device density with shortened pad distances while preventing electrical short-circuits through the physical segmentation provided by the isolation layer
Data Source
AI summary
A micro light emitting device display apparatus including a substrate, a plurality of micro light emitting devices, an isolation layer, and an air gap is provided. The micro light emitting devices are discretely disposed on the substrate. The isolation layer is disposed between the micro light emitting devices. The air gap is disposed between the micro light emitting devices, the isolation layer, and the substrate.