Micro LED Display Module Laser Transfer Bonding
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Solution Overview
Problem
The existing manufacturing processes for micro LED display modules face inefficiencies in both manufacturing and space utilization, particularly in bonding and connecting micro LEDs to substrates, which affects the overall efficiency and reliability of the display modules.
Innovation Solution
A method involving a laser transfer technique to stack and bond micro LEDs onto a display substrate using a connecting layer and anisotropic conductive members, allowing for efficient electrical and physical connection while maintaining space for alternative LEDs and a light blocking layer to enhance manufacturing and space efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional bonding processes are used to bond micro LEDs to substrates, then manufacturing complexity is reduced, but manufacturing efficiency and space utilization deteriorate
Solution Approach 1:
The patent introduces a transfer substrate as an intermediary component between the micro LED array and the display substrate. The transfer substrate enables batch transfer of multiple micro LEDs to the display substrate through laser irradiation, which activates the adhesive layer. This mediator approach allows efficient batch bonding while simplifying the overall manufacturing process by separating the picking and bonding operations.
2Area of stationary object
If micro LEDs are densely bonded on the substrate, then space efficiency is improved, but reliability deteriorates due to lack of replacement options for defective LEDs
Solution Approach 1:
The patent divides the display substrate into multiple pixel regions, where each pixel region contains multiple sub-pixels with different color characteristics. This segmentation allows for selective replacement of defective micro LEDs at the pixel level rather than requiring replacement of entire rows or columns, thereby maintaining high space efficiency while improving reliability through localized repair capability.
3Manufacturing precision
If conventional transfer methods are used, then manufacturing process simplicity is maintained, but manufacturing precision deteriorates
Solution Approach 1:
The patent replaces conventional mechanical transfer methods with a laser-based transfer mechanism. Laser irradiation is used to activate the adhesive layer on the transfer substrate, enabling precise bonding of micro LEDs to the display substrate. This substitution of mechanical systems with optical/thermal fields achieves high positioning precision while the automated laser processing maintains process simplicity.
4Area of stationary object
If connecting members are placed close together to bond micro LEDs, then space efficiency is improved, but manufacturing precision deteriorates due to difficulty in forming curved portions
Solution Approach 1:
The patent changes the physical parameters of the connecting members by forming them with curved portions instead of straight configurations. The curved shape allows the connecting members to accommodate the thermal expansion and contraction during the bonding process, and enables precise positioning even when connecting members are placed close together. This parameter change from straight to curved geometry resolves the conflict between space efficiency and manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves manufacturing efficiency and space utilization by enabling precise bonding and connection of micro LEDs, allowing for easier replacement of defective LEDs and increased light blocking efficiency, resulting in improved display module performance and reliability.
Implementation Method 1
separating the micro LED from the transfer substrate by expanding an adhesive layer formed between the micro LED and the transfer substrate through heating using a laser irradiation method
Implementation Method 2
transferring, to the display substrate, the micro LED and a connecting member that is in contact with the micro LED and is separated from the connecting layer by using a laser transfer method
Implementation Method 3
heating the micro LED and compressing the micro LED against the display substrate to bond the micro LED to the display substrate
Data Source
AI summary
A method of manufacturing a micro light emitting diode (LED) display module includes stacking a connecting layer onto a transfer substrate on which a micro LED is disposed; positioning the transfer substrate above a display substrate, in which a plurality of thin-film transistors are formed, so that the micro LED faces the display substrate; transferring, to the display substrate, the micro LED and a connecting member that is in contact with the micro LED and is separated from the connecting layer by using a laser transfer method; and heating the micro LED and compressing the micro LED against the display substrate to bond the micro LED to the display substrate by the connecting member.